GP2W0001YP
115 kbps Transceiver
IrDA Data Sheet
designed by considering 0.5 ms or more that is spec-
ified by IrDA. This turn around time means the time
that this device temporarily does not detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
FEATURES
• Built-in Photodiode
• Operating voltage 2.7 V to 5.5 V
• In circuit design, allow for the degradation of light
emitting diode output that results from long continu-
ous operation (50% degradation/5 years).
• Consider that 20 ms or more (at TA = 25°C, no input
signal) is necessary to return from shut-down mode
to ready operation mode. In addition, thoroughly
confirm the operation in the actual application.
• This product shall not contain the following materi-
als, and these materials shall not be used in the pro-
duction process for this product.
– CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOs and PBBs are not used in this device.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than the desired signal output may
be generated as noise on the output terminal of the
transceiver. Consider the layout and structure in your
design to minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method specified by ‘Serial Infrared Physical Layer
Link Specification’ published by the Infrared Data
Association. Faulty operation may occur if a signal
method other than that specified is used.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
NOTES
• Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
6
VCC
1
2
3
4
5
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
LEDA TXD SD RXD GND
CX1
R2
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi-
ate or potential defects.
RL
CX2
R1
TX
VCC
SD RXD
COMPONENTS RECOMMENDED VALUES
– Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
CX1
CX2
R1
47 µF/6.3 V (NOTE)
1500 pF/25 V
47 Ω ±5ꢀ% 1/10 W (NOTE)
1 kΩ ±5ꢀ% 1/10 W
• In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free envi-
ronment and workstation.
R2
2.2 Ω ±5ꢀ% 1/2 W
(VCC = 3.0 V% IE = 40 mW/sr)
RL
(STANDARD)
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
RL
33 Ω ±1ꢀ% 1/ꢁ W
(LOW POWER) (VCC = 3.0 V% IE = 3.6 mW/Sr)
NOTE: Choose the most suitable CX1 and R1 according to
the noise level and noise frequency of power supply.
• Refer to the ‘Precautions for Soldering’ section.
GP2W0001YP-1
• When the system (program) is designed, the turn
around time from transmit to receive should be
Figure 1. Recommended External Circuit
IrDA Data Sheet
1