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GMM3X60-015X2 PDF预览

GMM3X60-015X2

更新时间: 2024-11-21 14:56:27
品牌 Logo 应用领域
力特 - LITTELFUSE 二极管
页数 文件大小 规格书
6页 319K
描述
这些Mosfet模块系列提供SixPack配置,具有低导通电阻的快速切换沟槽Mosfet和坚固的续流二极管。

GMM3X60-015X2 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G24Reach Compliance Code:compliant
风险等级:5.76Is Samacsys:N
外壳连接:ISOLATED配置:BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (ID):57 A
最大漏源导通电阻:0.022 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G24元件数量:6
端子数量:24工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子面层:Tin (984) Over Nickel (39)
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

GMM3X60-015X2 数据手册

 浏览型号GMM3X60-015X2的Datasheet PDF文件第2页浏览型号GMM3X60-015X2的Datasheet PDF文件第3页浏览型号GMM3X60-015X2的Datasheet PDF文件第4页浏览型号GMM3X60-015X2的Datasheet PDF文件第5页浏览型号GMM3X60-015X2的Datasheet PDF文件第6页 
GMM3x60-015X2  
VDSS  
ID25  
= 150 V  
= 50 A  
Three phase full Bridge  
with Trench MOSFETs  
in DCB isolated high current package  
RDSon typ. = 19 mW  
L1+  
G3  
L2+  
G5  
L3+  
L3  
G1  
S1  
S3  
L1  
S5  
L2  
G2  
S2  
G4  
G6  
S4  
S6  
L1-  
L2-  
L3-  
Applications  
MOSFETs  
AC drives  
• in automobiles  
Symbol  
VDSS  
Conditions  
Maximum Ratings  
TVJ = 25°C to 150°C  
150  
V
- electric power steering  
- starter generator  
• in industrial vehicles  
- propulsion drives  
- fork lift drives  
VGS  
continous  
transient  
15  
20  
V
V
ID25  
ID90  
ID110  
TC = 25°C  
TC = 90°C  
TC = 110°C  
50  
38  
33  
A
A
A
• in battery supplied equipment  
IF25  
IF90  
IF110  
TC = 25°C (diode)  
TC = 90°C (diode)  
TC = 110°C (diode)  
150  
85  
65  
A
A
A
Features  
• MOSFETs in trench technology:  
- low RDSon  
- optimized intrinsic reverse diode  
• package:  
- high level of integration  
- high current capability  
- aux. terminals for MOSFET control  
- terminals for soldering or welding  
connections  
- isolated DCB ceramic base plate  
with optimized heat transfer  
• Space and weight savings  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min. typ. max.  
1)  
RDSon  
on chip level at  
VGS = 10 V; ID = 38 A  
TVJ = 25°C  
TVJ = 125°C  
19  
38  
24  
mW  
mW  
VGS(th)  
IDSS  
VDS = 20 V; ID = 1 mA  
VDS = VDSS; VGS = 0 V  
2.5  
4.5  
5
V
TVJ = 25°C  
TVJ = 125°C  
µA  
0.5  
mA  
IGSS  
VGS  
=
20 V; VDS = 0 V  
0.2  
µA  
Qg  
Qgs  
Qgd  
97  
29  
30  
nC  
nC  
nC  
VGS = 10 V; VDS = 75 V; ID = 38 A  
VGS = 10 V; VDS = 25 V; f = 1 MHz  
Ciss  
Coss  
Crss  
5800  
490  
85  
pF  
pF  
pF  
td(on)  
tr  
td(off)  
tf  
120  
50  
100  
25  
ns  
ns  
ns  
ns  
inductive load  
VGS = 10 V; VDS = 75 V  
ID = 38 A; RG(on) = 39 W; RG(off) = 4.7 W  
TJ = 125°C  
Eon  
Eoff  
Erecoff  
0.25  
0.05  
0.02  
mJ  
mJ  
mJ  
RthJC  
RthJH  
1)  
1.0 K/W  
1.6 K/W  
with heat transfer paste (IXYS test setup)  
= ID·(RDS(on) + 2RPin to Chip)  
1.3  
V
DS  
IXYS reserves the right to change limits, test conditions and dimensions.  
20170529c  
© 2017 IXYS All rights reserved  
1 - 6  

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