Wire Bonding/AuSn Soldering Mount Chip Multilayer Ceramic Capacitors for General Purpose
GMD155R71H561KA01_(1005M(0402), X7R(EIA), 560pF, DC 50V)
_:Package
Reference Sheet
Product specifications in this catalog are as of Apr.26,2022, and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering. Please read rating and !Cautions first.
■ Scope
This product specification is applied to Wire Bonding/AuSn Soldering Mount Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
■ MURATA Part No. System
(Ex.)
GMD
①Series
15
②Dimension
(L×W)
5
③Dimension
(T)
R7
1H
561
K
A01
D
④Temperature
Characteristics
⑤Rated
Voltage
⑥Capacitance
⑦Capacitance
Tolerance
⑧Individual
Specification
⑨Package
■ Type & Dimension
image:Dimension
1005M(0402)
② W
0.5+/-0.05
(in mm)
Size Code:
② L
e
g
③ T
0.5+/-0.05
1.0+/-0.05
0.15 to 0.35
0.3 min.
■ Rated Value
④Temperature Characteristics [R7]
(Public STD Code:[X7R(EIA)])
⑦
⑤Rated
Voltage
⑥
Mounting
Method
Operating Temp. Range
Capacitance
Tolerance
Capacitance
Temp. coeff. or Cap. Change
-15 to 15 %
Temp. Range
Ref.Temp.
-55 to 125℃
25℃
DC 50V
560pF
+/-10%
-55 to 125℃
Bonding
⑧Individual Specification : This denotes Murata control code.
■ Package
⑨Package
Packaging
φ180mm Reel PAPER Tape W8P2
φ330mm Reel PAPER Tape W8P2
Standard Packing Quantity
10000 pcs./Reel
D
J
50000 pcs./Reel
GMD155R71H561KA01-01A
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