High-luminosity(InGaN) Leadless Chip LED
GM1BC55200AC/GM1GC55200AC
1608 Size, 0.55mm Thickness,
Thin Type Leadless Chip LED
GM1BC55200AC/GM1GC55200AC
I Outline Dimensions
I Directive Characteristics
(Unit : mm)
(Ta=25˚C)
-20˚
0˚
+20˚
100
1.6±0.15
-40˚
+40˚
0.55±0.05
(0.2)
80
60
-60˚
-80˚
+60˚
+80˚
2
1
40
20
Emission center
0
1.2
1.0
Epoxy resin
X
-20˚
0˚
+20˚
1.Plating area
Resist
100
-40˚
+40˚
2.Pin connections
PWB
1Cathode
2Anode
80
60
(0.3)
(0.3)
-60˚
-80˚
+60˚
+80˚
40
20
1
2
3.Unspecified tolerance:±0.1
(0.3)
Chip side mark
0
Y
I Absolute Maximum Ratings
(Ta=25˚C)
Power dissipation Forward current Peak forward current Derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature
*1
*2
P
IF
IFM
(mA/˚C)
VR
Topr
Tstg
Tsol
Model No. Emitting color
Material
(mW)
(mA)
(mA)
(V)
(˚C)
(˚C)
(˚C)
DC Pulse
0.13 0.27
0.27 0.53
InGaN
InGaN
39
78
10
20
20
40
5
5
-20 to +80 -40 to +100
-20 to +80 -40 to +100
250
250
GM1BC55200AC Blue
GM1GC55200AC Green
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on page 2.
I Electro-optical Characteristics
(IF=10mA,Ta=25˚C)
Peak emission
wavelength
λp(nm)
TYP
470
Dominant
wavelength
λd(nm)
Luminous
intensity
IV(mcd)
TYP
13
Spectrum radiation
bandwidth
Page for
characteristics
diagrams
Reverse current
Forward voltage
VF(V)
Lens type
Model No.
IR(µA)
MAX
100
VR
(V)
4
∆λ(nm)
TYP
26
TYP
MAX
TYP
472
530
GM1BC55200AC
GM1GC55200AC
3.2
3.2
3.9
3.9
50
50
Colorless
transparency
528
47
36
100
4
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
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