Datasheet > GLZ2.0

GLZ2.0

更新时间： 2024-11-14 07:01:39

品牌	Logo	应用领域
DIOTECH		稳压二极管
页数	文件大小	规格书
4页	1513K
描述
500mW SUFACE MOUNT ZENER DIODE

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中文翻译

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数据手册

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GLZ2.0 数据手册

GLZ2.0 ~ GLZ56

500mW SUFACE MOUNT ZENER DIODE

FEATURES

• Planar Die construction

MINI-MELF / LL-34

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• Both normal and Pb free product are available :

Normal : 80~95% Sn, 5~20% Pb

Pb free: 98.5% Sn above

0.063(1.6)

0.055(1.4)

DIA.

0.020(0.5)

0.012(0.3)

0.020(0.5)

0.012(0.3)

MECHANICAL DATA

0.146(3.7)

0.130(3.3)

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

Dimensions in inches and (millimeters)

• Approx. Weight: 0.03 grams

• Mounting Position: Any

ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ )

Symbols

Value

Units

Zener current see table "Characteristics"

Power dissipation at TA=25℃

Junction temperature

Ptot

5001)

℃

175

Storage temperature range

TSTG

-65 to + 175

1)Valid provided that at a distance of 8mm from case are kept at ambient temperature

ELECTRICAL CHARACTERISTICS(TA=25℃ )

Symbols

RTHA

Min.

Typ.

Max.

0.31)

Units

K/mW

Thermal resistance junction to ambient

Forward voltage at IF=100mA

1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature

12 3 4

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