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GE28F640L30T90 PDF预览

GE28F640L30T90

更新时间: 2024-11-26 08:10:59
品牌 Logo 应用领域
恒忆 - NUMONYX /
页数 文件大小 规格书
92页 1208K
描述
Flash, 4MX16, 90ns, PBGA56, 0.75 MM PITCH, VFBGA-56

GE28F640L30T90 数据手册

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®
1.8 Volt Intel StrataFlash Wireless  
Memory with 3.0 Volt I/O (L30)  
28F640L30, 28F128L30, 28F256L30  
Datasheet  
Product Features  
High performance Read-While-Write/Erase  
— 90 ns initial access  
Software  
— 20 µs (Typ) program suspend  
— 50MHz with zero wait state, 17 ns clock-to-data  
— 20 µs (Typ) erase suspend  
output synchronous-burst mode  
— Intel® Flash Data Integrator (FDI) optimized  
— Basic Command Set (BCS) and Extended  
Command Set (ECS) compatible  
— 25 ns asynchronous-page mode  
— 4-, 8-, 16-, and continuous-word burst mode  
— Burst suspend  
— Common Flash Interface (CFI) capable  
— Programmable WAIT configuration  
— Buffered Enhanced Factory Programming  
(Buffered EFP): 3.5 µs/byte (Typ)  
— 1.8 V low-power buffered and non-buffered  
programming @ 10 µs/byte (Typ)  
Security  
OTP space:  
— 64 unique device identifier bits  
— 64 user-programmable OTP bits  
Architecture  
— Additional 2048 user-programmable OTP  
bits  
— Absolute write protection: VPP = GND  
— Power-transition erase/program lockout  
— Individual zero-latency block locking  
— Individual block lock-down  
— Asymmetrically-blocked architecture  
— Multiple 8-Mbit partitions  
— Four 16K-Word parameter blocks: top or  
bottom configurations  
— 64K-Word main blocks  
— Dual-operation: Read-While-Write (RWW) or  
Quality and Reliability  
Read-While-Erase (RWE)  
— Expanded temperature: –25° C – +85° C  
— Minimum 100,000 erase cycles per block  
— ETOX™ VIII process technology (0.13 µm)  
Density and Packaging  
— Status register for partition and device status  
Power  
— 1.7 V - 2.0 V VCC operation  
— I/O voltage: 2.2 V - 3.3 V  
— Standby current: 30 µA (Typ)  
— 4-Word synchronous read current: 17 mA (Typ)  
@ 54 MHz  
— 64-, 128- and 256-Mbit density in VF BGA  
packages  
— 16-bit wide data bus  
— Automatic Power Savings (APS) mode  
The 1.8 Volt Intel StrataFlash® wireless memory with 3-Volt I/O product is the latest generation of  
Intel StrataFlash® memory devices featuring flexible, multiple-partition, dual operation. It provides high  
performance asynchronous read mode and synchronous-burst read mode using 1.8 Volt low-voltage, multi-  
level cell (MLC) technology.  
The multiple-partition architecture enables background programming or erasing to occur in one partition  
while code execution or data reads take place in another partition. This dual-operation architecture also  
allows two processors to interleave code operations while program and erase operations take place in the  
background. 8-Mbit partitions allow system designers to choose the size ofthe code and data segments.  
The 1.8 Volt Intel StrataFlash® wireless memory with 3-Volt I/O device is manufactured using Intel  
0.13 µm ETOX™ VIII process technology. It is available in industry-standard chip scale packaging.  
.
Notice: This document contains information on products in the design phase of  
development. The information here is subject to change without notice. Do not finalize  
a design w ith this information.  
Order Number: 251903  
October 2002  

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