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GE28F640L30B85 PDF预览

GE28F640L30B85

更新时间: 2024-11-25 03:39:11
品牌 Logo 应用领域
英特尔 - INTEL 闪存存储内存集成电路无线
页数 文件大小 规格书
100页 1405K
描述
1.8 Volt Intel StrataFlash㈢ Wireless Memory with 3.0-Volt I/O (L30)

GE28F640L30B85 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:BGA包装说明:0.75 MM PITCH, VFBGA-56
针数:56Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.26最长访问时间:85 ns
其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B56
JESD-609代码:e0长度:9 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:4,63端子数量:56
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA56,7X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH页面大小:4 words
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:1.8,2.5/3 V编程电压:1.8 V
认证状态:Not Qualified座面最大高度:1 mm
部门规模:16K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.051 mA
最大供电电压 (Vsup):2 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30切换位:NO
类型:NOR TYPE宽度:7.7 mm
Base Number Matches:1

GE28F640L30B85 数据手册

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®
1.8 Volt Intel StrataFlash Wireless  
Memory with 3.0-Volt I/O (L30)  
28F640L30, 28F128L30, 28F256L30  
Datasheet  
Product Features  
High performance Read-While-Write/Erase  
— 85 ns initial access  
Software  
— 20 µs (Typ) program suspend  
— 52MHz with zero wait state, 17 ns clock-to-data  
— 20 µs (Typ) erase suspend  
output synchronous-burst mode  
— Intel® Flash Data Integrator (FDI) optimized  
— Basic Command Set (BCS) and Extended  
Command Set (ECS) compatible  
— 25 ns asynchronous-page mode  
— 4-, 8-, 16-, and continuous-word burst mode  
— Burst suspend  
— Common Flash Interface (CFI) capable  
— Programmable WAIT configuration  
— Buffered Enhanced Factory Programming  
(Buffered EFP): 3.5 µs/byte (Typ)  
Security  
OTP space:  
— 1.8 V low-power buffered and non-buffered  
— 64 unique device identifier bits  
— 64 user-programmable OTP bits  
programming @ 10 µs/byte (Typ)  
Architecture  
— Additional 2048 user-programmable OTP  
bits  
— Absolute write protection: VPP = GND  
— Power-transition erase/program lockout  
— Individual zero-latency block locking  
— Individual block lock-down  
— Asymmetrically-blocked architecture  
— Multiple 8-Mbit partitions: 64Mb and 128Mb  
devices  
— Multiple 16-Mbit partitions: 256Mb devices  
— Four 16-KWord parameter blocks: top or  
bottom configurations  
Quality and Reliability  
— 64K-Word main blocks  
— Expanded temperature: –25° C to +85° C  
— Minimum 100,000 erase cycles per block  
— ETOX™ VIII process technology (0.13 µm)  
Density and Packaging  
— Dual-operation: Read-While-Write (RWW) or  
Read-While-Erase (RWE)  
— Status register for partition and device status  
Power  
— 1.7 V - 2.0 V VCC operation  
— I/O voltage: 2.2 V - 3.3 V  
— Standby current: 30 µA (Typ)  
— 4-Word synchronous read current: 17 mA (Typ)  
@ 54 MHz  
— 64-, 128- and 256-Mbit density in VF BGA  
packages  
— 128/0, and 256/0 Density in Stacked-CSP  
— 16-bit wide data bus  
— Automatic Power Savings (APS) mode  
The 1.8 Volt Intel StrataFlash® wireless memory with 3-Volt I/O product is the latest generation of  
Intel StrataFlash® memory devices featuring flexible, multiple-partition, dual operation. It provides high  
performance synchronous-burst read mode and asynchronous read mode using 1.8 volt low-voltage, multi-  
level cell (MLC) technology.  
The multiple-partition architecture enables background programming or erasing to occur in one partition  
while code execution or data reads take place in another partition. This dual-operation architecture also  
allows two processors to interleave code operations while program and erase operations take place in the  
background.  
The 1.8 Volt Intel StrataFlash® wireless memory with 3-Volt I/O device is manufactured using Intel  
0.13 µm ETOX™ VIII process technology. It is available in industry-standard chip scale packaging.  
.
Notice: This document contains information on products in the design phase of  
development. The information here is subject to change without notice. Do not finalize  
a design with this information.  
Order Number: 251903-003  
April 2003  

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