生命周期: | Active | 包装说明: | FBGA, BGA225,15X15,32 |
Reach Compliance Code: | compliant | 风险等级: | 5.8 |
位大小: | 32 | JESD-30 代码: | S-PBGA-B225 |
端子数量: | 225 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | FBGA | 封装等效代码: | BGA225,15X15,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 0.85,2.5/3.3,3.3 V | 认证状态: | Not Qualified |
速度: | 133 MHz | 子类别: | Microprocessors |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
GDPXA250B1C200 | INTEL | Microprocessor, 32-Bit, 200MHz, CMOS, PBGA256, 17 X 17 MM, 0.61 MM HEIGHT, PLASTIC, BGA-25 |
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GDPXA250B1C300 | INTEL | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA256, |
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GDPXA250B1C400 | INTEL | Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 17 X 17 MM, 0.61 MM HEIGHT, PLASTIC, BGA-25 |
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GDPXA250B1E400 | INTEL | Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 17 X 17 MM, 0.61 MM HEIGHT, PLASTIC, BGA-25 |
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GDPXA250B2C400 | INTEL | Multifunction Peripheral, CMOS, PBGA256, MBGA-256 |
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GDPXA255A0C400 | INTEL | Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-25 |
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