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| 品牌 | Logo | 应用领域 |
| 兆易创新 - GIGADEVICE |  |
/ |
| 页数 | 文件大小 | 规格书 |
| 70页 | 2343K |  |
| 描述 | ||
| 兆易创新SPI Nor Flash和SPI NAND Flash可以提供WLCSP封装（Wafer Level Chip Scale Packaging）。不同于传统塑封封装，WLCSP是一种晶圆 | ||
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| GD25LH05C | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CEIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CHIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CMIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CNIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CQIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CSIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CTIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CUIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
| GD25LH05CVIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |
|
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