品牌 | Logo | 应用领域 |
兆易创新 - GIGADEVICE | / | |
页数 | 文件大小 | 规格书 |
69页 | 2166K | |
描述 | ||
兆易创新SPI Nor Flash和SPI NAND Flash可以提供WLCSP封装(Wafer Level Chip Scale Packaging)。不同于传统塑封封装,WLCSP是一种晶圆 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GD25LE80C | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CEEG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CEIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CEJG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CLEGR | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CLIGR | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CLJGR | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CMEG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CMIG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash | |
GD25LE80CMJG | GIGADEVICE |
获取价格 |
1.8V Uniform Sector Dual and Quad Serial Flash |