GBU8A THRU GBU8M
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIERS
Reverse Voltage – 50 to 1000 V
Forward Current – 8.0 A
Features
Glass passivated chip junction
Reliable low cost construction utilizing molded
plastic technique
Ideal for printed circuit board
Low forward voltage drop
Low reverse leakage current
High surge current capability
Mechanical Data
Case: Molded plastic, GBU
Epoxy: UL 94V-0 rate flame retardant
Terminals: leads solderable per MIL-STD-202,
Method 208 guaranteed
Mounting Position: Any
Absolute Maximum Ratings and Characteristics
Ratings at 25 ℃ ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or
inductive load. For capacitive load, derate current by 20%.
Symbols GBU8A GBU8B GBU8D GBU8G GBU8J GBU8K GBU8M Units
Parameter
Maximum recurrent peak reverse voltage
VRRM
VRMS
VDC
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
Maximum RMS voltage
Maximum DC blocking voltage
100
1000
1)
IF(AV)
IFSM
VF
8
200
1
A
A
Maximum average forward rectified current at TC = 100 ℃
Peak forward surge current , 8.3 ms single half-sine-wave
superimposed on rated load (JEDEC Method)
V
Maximum forward voltage at 4A DC and 25℃
Maximum reverse current at TA = 25 ℃
5
IR
µA
pF
500
at rated DC blocking voltage TA = 125 ℃
Typical junction capacitance 3)
Typical thermal resistance 4)
CJ
255
125
21
RJA
RJC
℃/W
Typical thermal resistance 4)
2.2
Operating and storage temperature range
TJ, TStg
-55 to +150
℃
1) Units case mounted on 3.2 X 3.2 X 0.12" thick (8.2 X 8.2 X 0.3 cm) AI plate heatsink.
2) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screws.
3) Measured at 1 MHz and applied reverse voltage of 4 VDC.
4) Units mounted in free air, no heatsink on P.C.B., 0.5 X 0.5" (12 X 12 mm) copper pads, 0.375" lead length.
®
Dated: 23/09/2019 Rev: 02