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GBU808G PDF预览

GBU808G

更新时间: 2024-11-26 01:01:27
品牌 Logo 应用领域
迪一电子 - DYELEC 局域网二极管
页数 文件大小 规格书
3页 864K
描述
SINGLE PHASE 8.0AMP GLASS PASSIVATED BRIDGE RECTIFIER

GBU808G 数据手册

 浏览型号GBU808G的Datasheet PDF文件第2页浏览型号GBU808G的Datasheet PDF文件第3页 
GBU8005G THRU GBU810G  
SINGLE PHASE 8.0AMP GLASS PASSIVATED BRIDGE RECTIFIER  
Features  
GBU  
· Glass passivated die construction  
· Low forward voltage drop  
· High current capability  
· High surge current capability  
· Plastic material-UL flammability 94V-0  
Mechanical Data  
m
Case: G B U , olded  
plastic  
·
·
Terminals: Plated Leads Solderable per  
MIL-STD-202, Method 208  
·
·
·
·
Polarity: As Marked on Case  
Mounting Position: Any  
Marking: Type Number  
Lead Free: For RoHS / Lead Free Version  
-
+
~
~
dimensions in inches and (millimeters)  
Maximum Ratings and Electrical Characteristics  
Rating at 25ambient temperature unless otherwise specified.  
Single Phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
GBU  
806G  
GBU  
808G 810G  
GBU  
GBU  
8005G  
GBU  
802G  
GBU  
GBU  
UNITS  
V
SYMBOL  
TYPE NUMBER  
801G  
804G  
VRRM  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
50  
35  
100  
70  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
VRWM  
VDC  
RMS Reverse Voltage  
V
A
VRMS  
280  
8.0  
Average Rectified Output Current (Note 1)@T =90  
C
IF(AV)  
Non-Repetitive Peak Forward Surge Current 8.3ms  
Single half sine-wave superimposed on rated load  
(JEDEC Method)  
IFSM  
200  
A
@IF=4A  
Forward Voltage per element  
@IF=8A  
1.0  
1.1  
VFM  
IR  
V
A
Peak Reverse Current  
@T =25  
5.0  
500  
uA  
At Rated DC Blocking Voltage @T  
A
=125℃  
2
I2t  
A2s  
166  
70  
Rating for fusing (t <8.3ms)  
I t  
Typical Junction Capacitance per leg  
pF  
(Note 2)  
CJ  
30.9  
RθJA  
Typical Thermal Resistance per leg (Note 3)  
Operating and Storage Temperature Range  
/W  
7.3  
RθJL  
-55to+150  
TJ,TSTG  
Note:1. Mounted on glass epoxy PC board with 1.3mm2 solder pad.  
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.  
3. Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.  
www.dyelec.com  
version:02  
1 of 3  

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