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GBU2010S PDF预览

GBU2010S

更新时间: 2024-10-29 14:54:19
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 393K
描述

GBU2010S 数据手册

 浏览型号GBU2010S的Datasheet PDF文件第2页浏览型号GBU2010S的Datasheet PDF文件第3页 
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20ꢀ$PSꢀ  
Features  
6LQJOHꢀ3KDVH  
*ODVVꢀ3DVVLYDWHG  
%ULGJHꢀ5HFWLILHU  
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• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix  
Designates Compliant. See Ordering Information)  
(SR[\ꢀ0HHWVꢀ8/ꢀꢃꢄꢀ9ꢂꢅꢀ)ODPPDELOLW\ꢀ5DWLQJ  
• High Surge Overload Rating  
Maximum Ratings  
2SHUDWLQJꢀ-XQFWLRQꢀ7HPSHUDWXUHꢀ5DQJH: -55°C to +150°C  
6WRUDJHꢀ7HPSHUDWXUHꢀ5DQJH: -55°C to +150°C  
• Thermal Resistance: 1.5°C/W Junction to Case (Note 2)  
• Thermal Resistance: 25°C/W Junction to Ambient  
GBU  
0HFKDQLFDOꢀ'DWD  
3.2x45  
A
C
• Mounting Torque: 5in-lbs  
N
N
N
G
H
Maximum  
B
,
Maximum  
RMS  
Voltage  
Maximum DC  
Blocking  
Device  
MCC  
Recurrent  
Peak Reverse  
Voltage  
J
1.90 RADIUS  
N
Marking  
Part Number  
-
~
~
+
Voltage  
K
D
GBU2010S  
GBU2010S  
1000V  
700V  
1000V  
L
E
M
F
(OHFWULFDOꢀ&KDUDFWHULVWLFVꢀ#ꢀꢁꢂƒ&ꢀ8QOHVVꢀ2WKHUZLVHꢀ6SHFL¿HG  
20A  
TC= 90°C,With Heatsink  
Average  
Forward Current  
IF(AV)  
DIMENSIONS  
MM  
MIN MAX MIN MAX  
3.5A  
TA= 25°C,Without Heatsink  
INCHES  
DIM  
NOTE  
Peak Forward  
Surge Current  
IFSM  
250A  
8.3ms, Half Sine  
A
B
C
D
E
F
G
H
,
J
K
L
M
N
0.860 0.880 21.80 22.30  
0.720 0.740 18.30 18.80  
0.130 0.142 3.30 3.60  
0.690 0.717 17.50 18.20  
0.030 0.039 0.76 1.00  
0.018 0.024 0.46 0.60  
0.290 0.310 7.40 7.90  
0.140 0.160 3.50 4.10  
0.065 0.085 1.65 2.16  
0.060 0.096 1.52 2.45  
0.077 0.098 1.95 2.50  
0.040 0.050 1.02 1.27  
0.190 0.210 4.83 5.33  
7.0° TYPICAL  
Maximum Forward  
Voltage Drop Per  
Element  
IFM = 10A Per  
VF  
1.0V  
Diode; TJ= 25°C  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
5μA  
TJ = 25°C  
IR  
100uA  
TJ = 125°C  
VISO  
I2t  
2.5KV  
Terminals to Case, AC 1 Minute  
t<8.3ms  
Dielecric Strength  
Rating for Fusing  
260 A2s  
Typical Junction  
Capacitance  
Measured at  
1.0MHz, VR=4.0V  
CJ  
80 pF  
Note: 1. High Temperature Solder Exemption Applied, 6ee EU Directive Annex 7a  
2. Device mounted on 75mm x 45mm x 5.5mm Aluminum Plate Heatsink.  
Rev.3-1-06252022  
1/3  
MCCSEMI.COM  

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