Glass Passivated Bridge Rectifiers
GBU15005-G Thru. GBU1510-G
Reverse Voltage: 50 to 1000V
Forward Current: 15.0A
RoHS Device
GBU
Features
-Surge overload rating - 240 amperes peak.
0.437(11.1)
0.430(10.9)
0.139(3.53)
0.133(3.37)
-Ideal for printed circuit board.
0.874(22.2)
0.860(21.8)
0.126(3.2)*45°
Chamfer
0.161(4.1)
0.134(3.4)
0.232(5.90)
0.213(5.40)
0.752(19.1)
0.720(18.3)
0.401(10.2)
0.073(1.85)
0.057(1.45)
0.392(9.80)
Mechanical Data
-Epoxy: U/L 94-V0 rate flame retardant.
-Case: Molded plastic, GBU
-Mounting position: Any
0.100(2.54)
0.085(2.16)
0.720(18.29)
0.680(17.27)
0.106(2.7)
0.091(2.3)
0.080(2.03)
0.065(1.65)
0.047(1.2)
0.035(0.9)
0.022(0.56)
0.018(0.46)
-Weight: 3.91grams
0.210(5.3)
0.190(4.8)
0.210(5.3)
0.190(4.8)
0.210(5.3)
0.190(4.8)
Dimensions in inches and (millimeter)
Maximum ratings and electrical characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
GBU
15005-G
GBU
1501-G
GBU
1502-G
GBU
1504-G
GBU
1506-G
GBU
1508-G
GBU
Symbol
Parameter
Unit
1510-G
1000
700
Maximum Reverse Peak Repetitive Voltage
V
RRM
RMS
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
V
V
V
V
Maximum RMS Voltage
VDC
100
1000
Maximum DC Blocking Voltage
15.0
3.2
Maximum Average Forward (With heatsink Note2)
Rectified Current @Tc=100°C (without hestsink)
I
(AV)
A
A
Peak Forward Surage Current ,
IFSM
8.3ms Single Half Sine-Wave
240
Super Imposed On Rated Load(JEDEC Method)
Maximum Forward Voltage at 7.5A
1.1
VF
V
@TJ=25°C
@TJ=125°C
10.0
500
Maximum DC Reverse Current
At Rate DC Blocking Voltage
μA
IR
I2 T Rating for Fusing(t<8.3ms)
A2s
pF
I2t
200
Typical Junction Capacitandce Per Element
(Note 1)
C
J
70
OC/W
OC
Typical Thermal Resistance
RθJC
2.2
Operating Temperature Range
-55 to +150
-55 to +150
TJ
Storage Temperature Range
Notes:
TSTG
OC
1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Device mounted on 100mm*100mm*1.6mm Cu plate heatsink.
REV:A
Page 1
QW-BBR64
Comchip Technology CO., LTD.