Datasheet > GBU1502

GBU1502

更新时间： 2024-02-16 02:26:12

品牌	Logo	应用领域
佑风微 - YFW		/
页数	文件大小	规格书
2页	671K
描述
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

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技术参数
数据手册

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GBU1502 技术参数

生命周期：	Contact Manufacturer	Reach Compliance Code：	unknown
ECCN代码：	EAR99	风险等级：	5.84

GBU1502 数据手册

GBU15005 THRU GBU1510

GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

REVERSE VOLTAGE:

FORWARD CURRENT:

50 to 1000 VOLTS

15.0 AMPERE

FEATURES

· Glass passivated chip junction

· Reliable low cost construction utilizing molded

plastic technique

GBU

· Ideal for printed circuit board

7°

3.2X45°

7°

· Low forward voltage drop

· Low reverse leakage current

· High surge current capability

R7,6

7°

MECHANICAL DATA

Case: Molded plastic, GBJ

Epoxy: UL 94V-O rate flame retardant

Terminals: Leads solderable per MIL-STD-202,

method 208 guaranteed

Mounting position: Any

Dimensions in inches and (millimeters)

Weight: 0.23ounce, 6.6gram

Maximum Ratings and Electrical Characteristics

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60H_Z, resistive or inductive load.

For capacitive load, derate current by 20%.

GBU15005 GBU1501 GBU1502 GBU1504 GBU1506 GBU1508 GBU1510

Symbols

Units

Volts

V_RRM

V_RMS

V_DC

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

100

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Maximum DC Blocking Voltage

Maximum Average Forward Rectified Current

with Heatsink at T_C=100℃

100

1000

I_(AV)

Amp

15.0

Peak Forward Surge Current,

I_FSM

Amp

200

8.3ms single half-sine-wave

superimposed on rated load (JEDEC method)

Maximum Forward Voltage Drop per Element

at 7.5A DC and 25℃

V_F

I_R

Volts

1.05

at T_A=25℃

T_A=125℃

10.0

500

Maximum Reverse Current

at Rated DC Blocking Voltage

uAmp

C_J

Typical Junction Capacitance (Note 1)

Typical Thermal Resistance (Note 2)

Operating and Storage Temperature Range

℃/W

℃

R_θJC

0.8

-55 to +150

T_J，Tstg

NOTES:

1- Measured at 1 MH_Zand applied reverse voltage of 4.0 VDC.

2- Thermal Resistance fromn Junction to Case with Device Mounted on 300mm x 300mm x 1.6mmCu Plate Heatsink.

www.yfwdiode.com

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