*%3&ꢀꢁꢃ2H
E502650
ꢀꢁꢂ$PSꢂ*ODVVꢂ
Features
3DVVLYDWHGꢂ6LQJOHꢂ
3KDVHꢂ%ULGJHꢂ
5HFWLILHU
/HDGꢀ)UHHꢀ)LQLVKꢁ5R+6ꢀ&RPSOLDQWꢀꢂ1RWHꢃꢄꢀꢂꢅ3ꢅ6XIIL[ꢀ'HVLJQDWHV
&RPSOLDQWꢆꢀ6HHꢀ2UGHULQJꢀ,QIRUPDWLRQꢄ
With Heat Sink on Top Vacuum Soldering Process Minimize The
Solder Voids, Typical Voids are 2% and Max Voids Less Than 8%
ꢃ2ꢁꢁꢂ9ROWV
(SR[\ꢀ0HHWVꢀ8/ꢀꢁꢂꢀ9ꢃꢄꢀ)ODPPDELOLW\ꢀ5DWLQJ
$Q\ꢀ0RXQWLQJꢀ3RVLWLRQ
Maximum Ratings
GBPC-H
2SHUDWLQJꢀ-XQFWLRQꢀ7HPSHUDWXUHꢀ5DQJHꢄꢅꢆꢇꢇ&ꢅWRꢅꢈꢁꢇꢉ&
6WRUDJHꢀ7HPSHUDWXUHꢀ5DQJHꢄꢅꢆꢇꢇ&ꢅWRꢅꢈꢁꢇꢉ&
7KHUPDOꢀ5HVLVWDQFHꢁꢀꢂꢃꢄ&ꢅ:ꢀ-XQFWLRQꢀtRꢀ&DVH
G
B
+
AC
0HFKDQLFDOꢀ'DWD
F
C
0RXQWLQJꢀ7RUTXHꢁꢀꢀꢅꢆꢄꢀLQꢃlEVꢀ0D[LPXP
0RXQWLQJꢀ+ROHꢀ)RUꢀꢇꢈꢄꢀ6FUHZ
D
A
AC
-
0D[LPXP
0D[LPXP
506ꢀ
9ROWDJH
0D[LPXPꢅ'&
%ORFNLQJ
'HYLFH
0DUNLQJ
0&&
3DUWꢅ1XPEHU
5HFXUUHQW
3HDNꢀ5HYHUVH
9ROWDJHꢀ
E
9ROWDJH
H
*%3&ꢁꢂꢃ2H
*%3&ꢁꢂꢃ2
ꢁ2ꢉꢉ9
84ꢉ9
ꢁ2ꢉꢉ9
J
(OHFWULFDOꢀ&KDUDFWHULVWLFVꢀ#ꢀꢁꢂ&ꢀ8QOHVVꢀ2WKHUZLVHꢀ6SHFL¿HG
$YHUDJH
)RUZDUGꢀ&XUUHQW
I
,
ꢁꢂ$
7& ꢅꢁꢁ&ꢀ:LWKꢀ+HDWVLQN
ꢊꢀꢃPVꢋꢅ+DOIꢅ6LQH
)ꢄ$9ꢅ
3HDNꢅ)RUZDUGꢅ
6XUJHꢅ&XUUHQWꢅ
,
ꢁꢂꢉ$
)60
DIMENSIONS
MM
0D[LPXPꢀ)RUZDUG
9ROWDJHꢀ'URSꢀ3HU
(OHPHQWꢅ
INCHES
,
)0ꢅ ꢅꢆꢁ$ꢀ3HUꢀ(OHPHQWꢇꢅ
DIM
NOTE
9)
ꢁꢀꢃ9
MIN MAX MIN MAX
1.114 1.134 28.30 28.80
0.634 0.673 16.10 17.10
0.634 0.673 16.10 17.10
0.543 0.583 13.80 14.80
0.693 0.732 17.60 18.60
7- ꢅꢆꢁ&
A
B
C
D
E
F
G
H
I
0D[LPXPꢅ'&ꢅ
5HYHUVHꢅ&XUUHQWꢅaWꢅ
5DWHGꢅ'&ꢅ%ORFNLQJꢅ
9ROWDJH
ꢁȝ$
7-ꢅ ꢅꢌꢇ&
,
5
ꢁꢂꢂȝ$
7-ꢅ ꢅꢃꢆꢁ&
5.00 Nominal
0.197 Nominal
Φ
0.030 0.034 0.76 0.86
0.244 0.256 6.20 6.50
0.291 0.335 7.40 8.50
0.874 0.953 22.20 24.20
I2t
1037A2s
1ms≤t≤8.3ms
Rating for Fusing
J
'LHOHFWULFꢀ6WUHQJWKꢉꢀ
7HUPLQDOV
WRꢀ&DVHꢉꢀ$&ꢀꢃꢀ0LQXWH
9GLV
ꢆꢈꢁ.9
1RWHꢄꢅꢁꢀꢅ+LJKꢅ7HPSHUDWXUHꢅ6ROGHUꢅ([HPSWLRQꢅ$SSOLHGꢋꢅ6HHꢅ(8ꢅ'LUHFWLYHꢅ$QQH[ꢅ1RWHVꢀꢍDꢀ
5HYꢁꢂꢃ4-12012020
ꢁꢂꢃ
0&&6(0,ꢀ&20