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Features
50 Amp Glass
• Halogen Free Available Upon Request By Adding Suffix "-HF"
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• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix
Designates Compliant. See Ordering Information)
• Epoxy Meets UL 94 V-0 Flammability Rating
• High Current Capability
1000 Volts
• Glass Passivated Chip Junction
Maximum Ratings
• Operating Junction Temperature Range: -55°C to +150°C
• Storage Temperature Range: -55°C to +150°C
GBJ
• Typical Thermal Resistance: 0.8°C/W Junction to Case(Note2)
I
0HFKDQLFDOꢀ'DWD
A
H
• Mounting Torque: 5in-lbs
G
B
D
Maximum
E
Maximum
RMS
Voltage
Maximum DC
Blocking
+
Device
MCC
Recurrent
Peak Reverse
Voltage
F
Marking
Part Number
Voltage
P
C
L
GBJ5010S
GBJ5010S
1000V
700V
1000V
M
K
J
N
O
O
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TC= 100°C,With Heatsink
TA= 25°C,Without Heatsink
50A
Average
Forward Current
IF(AV)
DIMENSIONS
MM
5.2A
INCHES
DIM
NOTE
Peak Forward
Surge Current
MIN MAX MIN MAX
1.170 1.190 29.70 30.30
0.780 0.800 19.70 20.30
0.670 0.710 17.00 18.00
0.190 0.190 4.70 4.90
0.430 0.440 10.80 11.20
0.090 0.110 2.30 2.70
0.120 0.130 3.10 3.40
0.130 0.150 3.40 3.80
0.170 0.190 4.40 4.80
0.100 0.110 2.50 2.90
0.020 0.030 0.60 0.80
0.080 0.090 2.00 2.40
0.040 0.040 0.90 1.10
0.390 0.400 9.80 10.20
0.290 0.300 7.30 7.70
0.150 0.170 3.80 4.20
IFSM
500A
8.3ms, Half Sine
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Maximum Forward
Voltage Drop Per
Element
IFM = 25A Per Diode;
VF
1.0V
TJ= 25°C
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
5μA
TJ = 25°C
IR
200uA
TJ = 125°C
VISO
I2t
2.5KV
Terminals to Case, AC 1 Minute
Dielecric Strength
Rating for Fusing
1037 A2s
t<8.3ms
Typical Junction
Capacitance
Measured at
1.0MHz, VR=4.0V
CJ
190 pF
Note: 1. High Temperature Solder Exemption Applied, See EU Directive Annex 7a.
2. Device mounted on 75mm x 45mm x 5.5mm Aluminum Plate Heatsink.
Rev.3-1-06012022
1/3
MCCSEMI.COM