Datasheet > GBJ5006

GBJ5006

更新时间： 2024-02-08 15:22:00

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描述
Voltage 50V ~ 1000V 50.0 Amp Glass Passivited Bridge Rectifiers

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技术参数
数据手册

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GBJ5006 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.69	Base Number Matches：	1

GBJ5006 数据手册

GBJ50005 ~ GBJ5010

Voltage 50V ~ 1000V

50.0 Amp Glass Passivited Bridge Rectifiers

Elektronische Bauelemente

RoHS Compliant Product

A suffix of “-C” specifies halogen & lead-free

GBJ

FEATURES

ꢀ

Rating to 1000V PRV

Ideal for printed circuit board

Low forward voltage drop, high current capability

Reliable low cost construction utilizing molded plastic

technique results in inexpensive product

ꢀ

The plastic material has Underwriters Laboratory

flammability classification 94V-0

Millimeter

Min. Max.

REF.

Min.

Max.

30.3

20.3

4.8

29.7

19.7

4.4

0.6

7.3

2.0

9.8

0.8

7.7

2.4

17.0

18.0

10.2

3.0 x 45°

2.3

3.6

2.7

4.2

3.1

3.4

5.1

2.9

1.1

10.8

3.1

11.2

3.4

2.5

0.9

3.4

3.8

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

(Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load.

For capacitive load, de-rate current by 20%.)

Part Number

Parameter

Symbol

Unit

GBJ

50005

GBJ

5001

GBJ

5002

GBJ

5004

GBJ

5006

GBJ

5008

GBJ

5010

1000

700

V_RRM

V_RMS

V_DC

100

200

140

200

400

280

400

600

420

600

800

560

800

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Bridge Input Voltage

100

1000

Maximum DC Blocking Voltage

Maximum Average Forward (with heat sink²)

I_(AV)

Rectified Current @T_C=100°C (without heat sink)

Peak Forward Surge Current 8.3 ms Single Half

Sine-Wave Super Imposed on Rated Load

(JEDEC Method)

I_FSM

V_F

I_R

400

Maximum Forward Voltage @ 25A DC

1.1

10.0

T_J=25°C

Maximum DC Reverse Current

µA

at Rated DC Blocking Voltage

T_J=125°C

500

I²t Rating for Fusing (t<8.3ms)

Typical Thermal Resistance ¹

I²t

660

A²s

°C/W

°C

RθJC

1.5

Operating and Storage temperature range

T_J,T_STG

-55~150

Notes：

1. Thermal resistance from junction to case with units mounted on heat sink.

2. Device mounted on 300mm*300mm*1.6mm Cu plate heat sink.

http://www.SeCoSGmbH.com/

Any changes of specification will not be informed individually.

19-Oct-2011 Rev. A

Page 1 of 2

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