GBJ5005 THRU GBJ5010
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
REVERSE VOLTAGE:
FORWARD CURRENT:
50 to 1000 VOLTS
50.0 AMPERE
FEATURES
· Glass passivated chip junction
· Reliable low cost construction utilizing molded
plastic technique
GBJ
· Ideal for printed circuit board
· Low forward voltage drop
· Low reverse leakage current
· High surge current capability
MECHANICAL DATA
Case: Molded plastic, GBJ
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Dimensions in inches and (millimeters)
Mounting position: Any
Weight: 0.23ounce, 6.6gram
Maximum Ratings and Electrical Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
GBJ5005 GBJ5001 GBJ5002 GBJ5004 GBJ5006 GBJ5008 GBJ5010
Symbols
Units
Volts
Volts
Volts
VRRM
VRMS
VDC
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
with Heatsink at TC=100℃
100
1000
I(AV)
Amp
50.0
400
1.1
Peak Forward Surge Current,
IFSM
Amp
8.3ms single half-sine-wave
superimposed on rated load (JEDEC method)
Maximum Forward Voltage Drop per Element
at 12.5A DC and 25℃
VF
IR
Volts
at TA=25℃
TA=125℃
10.0
500
Maximum Reverse Current
at Rated DC Blocking Voltage
uAmp
CJ
85
Typical Junction Capacitance (Note 1)
Typical Thermal Resistance (Note 2)
Operating and Storage Temperature Range
pF
℃/W
℃
RθJC
0.6
-55 to +150
TJ,Tstg
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance fromn Junction to Case with Device Mounted on 300mm x 300mm x 1.6mmCu Plate Heatsink.
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