Datasheet > GBJ30M

GBJ30M

更新时间： 2024-09-14 01:08:03

品牌	Logo	应用领域
GENESIC		/
页数	文件大小	规格书
3页	1094K
描述
Single Phase Glass Passivated Silicon Bridge Rectifier

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中文翻译

获取价格

数据手册

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GBJ30M 数据手册

GBJ30J thru GBJ30M

V_RRM= 600 V - 1000 V

I_O= 30 A

Single Phase Glass Passivated

Silicon Bridge Rectifier

Features

• Epoxy Resin material compliant with 94V-0 standards

of UL Material Flammability Provisions

• Compliant with RoHS Provisions

• Single in-line DIP package, compact size

• Low forward voltage, high forward current

• High surge current capability

GBJ Package

• Types from 600 V to 1000 V V_RRM

• Small size, high heat-conducting performance

• Thermal welding performance: 260 ^oC/10 s

• Weight: 7.25 g (0.25 Oz)

• Not ESD Sensitive

Maximum ratings at T_A= 25 °C (ambient temperature), unless otherwise specified

Conditions

GBJ30J

GBJ30K

GBJ30M

Parameter

Symbol

Unit

V_RRM

V_DC

T_j

600

800

1000

Repetitive peak reverse voltage

DC blocking voltage

600

800

-50 to 150

Operating temperature

Storage temperature

°C

T_stg

Electrical characteristics at T_A= 25 °C, unless otherwise specified

Resistive load, single phase, half sine wave, 60 Hz.

For capacitive load derate current by 20%.

Conditions

GBJ30J

GBJ30K

GBJ30M

Parameter

Symbol

Unit

30 ⁽¹⁾

5.2 ⁽²⁾

30 ⁽¹⁾

5.2 ⁽²⁾

30 ⁽¹⁾

5.2 ⁽²⁾

T_C= 98 °C

T_A= 25 °C

Maximum average forward

rectified current

I_O

8.3 ms pulse width,

single pulse sine-wave,

rated load, T_j= 25 °C

I_FSM

420

Maximum forward surge current

Maximum forward voltage

V_F

I_R

I_F= 15 A

T_A= 25 °C

T_A= 125 °C

1.05

Max. reverse current leakage at

rated DC blocking voltage

μA

500

AC Voltage: 1 minute,

current leakage < 1 mA

Insulation strengthg (Lead wire

to case)

V_dis

2.5

A²s

I²t

R_ΘJA

1ms ≤ t < 10ms, T_j=25 °C

without heatsink

350

Fusing feature

22 ⁽²⁾

1.0 ⁽¹⁾

22 ⁽²⁾

1.0 ⁽¹⁾

22 ⁽²⁾

1.0 ⁽¹⁾

^oC/W

Thermal resistance

R_ΘJC

with stated size heatsink

1.0 ( 0.8 Nm is recomended )

Mounting torgue

TOR

Remarks: (1) Install on PCB with stated size heat sink. In order to reach excellent heat dissipation performance, please coat thermal

conductive sillica gel in moderation, use M3 screw to screw up. Recommended heatsink size: 15.2*15.2*12.8 cm.

(2) Install on PCB without heatsink.

Oct. 2018

http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj30j.pdf

12 3

中文翻译

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