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GBJ2510S PDF预览

GBJ2510S

更新时间: 2024-11-12 14:52:19
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 281K
描述

GBJ2510S 数据手册

 浏览型号GBJ2510S的Datasheet PDF文件第2页浏览型号GBJ2510S的Datasheet PDF文件第3页 
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Features  
25 Amp Glass  
Halogen Free Available Upon Request By Adding Suffix "-HF"  
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• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix  
Designates Compliant. See Ordering Information)  
Epoxy Meets UL 94 V-0 Flammability Rating  
High Current Capability  
1000 Volts  
Glass Passivated Chip Junction  
Maximum Ratings  
Operating Junction Temperature Range: -55°C to +150°C  
Storage Temperature Range: -55°C to +150°C  
GBJ  
• Typical Thermal Resistance: 1°C/W Junction to Case(Note2)  
I
0HFKDQLFDOꢀ'DWD  
A
H
• Mounting Torque: 5in-lbs  
G
B
D
Maximum  
E
Maximum  
RMS  
Voltage  
Maximum DC  
Blocking  
+
Device  
MCC  
Recurrent  
Peak Reverse  
Voltage  
F
Marking  
Part Number  
Voltage  
P
C
L
GBJ2510S  
GBJ2510S  
1000V  
700V  
1000V  
M
K
J
N
O
O
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TC= 100°C,With Heatsink  
TA= 25°C,Without Heatsink  
25A  
4A  
Average  
Forward Current  
IF(AV)  
DIMENSIONS  
MM  
INCHES  
DIM  
NOTE  
Peak Forward  
Surge Current  
MIN MAX MIN MAX  
1.170 1.190 29.70 30.30  
0.780 0.800 19.70 20.30  
0.670 0.710 17.00 18.00  
0.190 0.190 4.70 4.90  
0.430 0.440 10.80 11.20  
0.090 0.110 2.30 2.70  
0.120 0.130 3.10 3.40  
0.130 0.150 3.40 3.80  
0.170 0.190 4.40 4.80  
0.100 0.110 2.50 2.90  
0.020 0.030 0.60 0.80  
0.080 0.090 2.00 2.40  
0.040 0.040 0.90 1.10  
0.390 0.400 9.80 10.20  
0.290 0.300 7.30 7.70  
0.150 0.170 3.80 4.20  
IFSM  
320A  
8.3ms, Half Sine  
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Maximum Forward  
Voltage Drop Per  
Element  
IFM = 12.5A Per Diode;  
VF  
1.0V  
TJ= 25°C  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
5μA  
TJ = 25°C  
IR  
100uA  
TJ = 125°C  
VISO  
I2t  
2.5KV  
Terminals to Case, AC 1 Minute  
Dielecric Strength  
Rating for Fusing  
425 A2s  
t<8.3ms  
Typical Junction  
Capacitance  
Measured at  
1.0MHz, VR=4.0V  
CJ  
100 pF  
Note: 1. High Temperature Solder Exemption Applied, See EU Directive Annex 7a.  
2. Device mounted on 75mm x 45mm x 5.5mm Aluminum Plate Heatsink.  
Rev.3-1-06012022  
1/3  
MCCSEMI.COM  

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