GBJ10005 - GBJ1010
10A GLASS PASSIVATED BRIDGE RECTIFIER
Features
GBJ
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Glass Passivated Die Construction
High Case Dielectric Strength of 1500VRMS
Low Reverse Leakage Current
Dim
A
B
C
D
E
Min
29.70
19.70
17.00
3.80
7.30
9.80
2.00
0.90
2.30
Max
30.30
20.30
18.00
4.20
Surge Overload Rating to 170A Peak
Ideal for Printed Circuit Board Applications
L
UL Listed Under Recognized Component Index, File Number
E94661
A
M
K
7.70
·
Lead Free Finish/RoHS Compliant (Note 4)
G
H
I
10.20
2.40
B
D
S
N
_
Mechanical Data
·
1.10
J
P
Case: GBJ
J
2.70
H
I
C
·
Case Material: Molded Plastic - UL Flammability
Classification Rating 94V-0
K
L
3.0 X 45°
R
4.40
3.40
3.10
2.50
0.60
10.80
4.80
3.80
3.40
2.90
0.80
11.20
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Moisture Sensitivity: Level 1 per J-STD-020C
M
N
P
Terminals: Plated Leads, Solderable per MIL-STD-202,
Method 208
e
3
G
E
E
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Lead Free Plating (Tin Finish).
Polarity: Molded on Body
R
S
Mounting: Through Hole for #6 Screw
Mounting Torque: 5.0 in-lbs Maximum
Marking: Type Number
All Dimensions in mm
Weight: 6.6 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
GBJ
GBJ
GBJ
1002
GBJ
1004
GBJ
1006
GBJ
1008
GBJ
1010
Characteristic
Symbol
Unit
10005 1001
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
50
35
100
70
200
140
400
600
420
800
560
1000
700
V
VR(RMS)
IO
RMS Reverse Voltage
280
10
V
A
Average Forward Rectified Output Current
@ TC = 110°C
Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load
IFSM
VFM
IR
170
A
V
Forward Voltage per element
@ IF = 5.0A
1.05
10
500
Peak Reverse Current
at Rated DC Blocking Voltage
@TC 25°C
=
mA
@ TC = 125°C
I2t Rating for Fusing (t < 8.3ms) (Note 1)
I2t
CT
120
55
A2s
pF
Typical Total Capacitance per Element (Note 2)
Typical Thermal Resistance, Junction to Case (Note 3)
Operating and Storage Temperature Range
RqJC
Tj, TSTG
1.4
°C/W
°C
-65 to +150
Notes: 1. Non-repetitive, for t > 1.0ms and < 8.3ms.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
3. Thermal resistance from junction to case per element. Unit mounted on 150 x 150 x 1.6mm copper plate heat sink.
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS21218 Rev. 7 - 2
1 of 3
GBJ10005-GBJ1010
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ã Diodes Incorporated