Global Mixed-mode Technology Inc.
G5258
Dual Power Distribution Switch
Features
General Description
The G5258 is an integrated dual channel 87mΩ power
switch for self-powered and bus-powered Universal
Serial Bus (USB) applications.
87mΩ High-Side MOSFET
Available with 4 Versions of Current Limits with
Foldback
Operating Range:2.7V to 5.5V
400µS Typical Rise Time
Under voltage Lockout
65µA Quiescent Supply Current
1µA Maximum Shutdown Supply Current
Logic Level Enable Pin, Available with
Active-High or Active-Low Version
No Reverse Current to VIN when Power Off
VOUT OFF Discharge
Several Protection features include current limiting
with foldback, and thermal shutdown to prevent catas-
trophic switch failure caused by increasing power dis-
sipation when continuous heavy loads or short circuit
occurs. And a built-in charge pump is used to drive the
N-channel MOSFET that is free of parasitic body diode
to eliminate any reversed current flow across the
switch when it is powered off.
Deglitched Open-Drain Over-Current Flag
OC is open-drain output report over-current or
over-temperature event and has typical 9ms deglitch
timeout period.
Output ( OC )
SOP-8 Package and TDFN3X3-8 Package
UL Approved_#E232223
Nemko IEC 60950-1 CB/CCA_scheme certifica-
tion Report #67291
CSA Approved #230321
Applications
High-Side Power Protection Switch
USB Power Management
USB Host and Self-Powered Bubs
USB Bus-Powered Hubs
Hot Plug-In Power Supplies
Battery-Charger Circuits
Pin Configuration
Typical Application Circuit
G5258
8
7
6
5
1
OC1
GND
OUT1
2
3
4
IN
EN1(EN1)
EN2 (EN2)
OUT2
OC2
Power Supply
2.7V to 5.5V
IN
OUT1
OUT2
Load
Load
SOP-8
G5258
1µF
22µF
22µF
0.1µF
0.1µF
OC1
EN1 (EN1)
OC2
8
GND
1
OC1
EN2 (EN2)
OUT1
OUT2
OC2
IN
2
3
4
7
6
5
Thermal
Pad
EN1(EN1)
EN2 (EN2)
TDFN3X3-8
Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
R
UL Recognized Component
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver 1.6
Apr 12, 2011
1