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G11135-512DE PDF预览

G11135-512DE

更新时间: 2024-01-08 07:46:51
品牌 Logo 应用领域
HAMAMATSU 传感器换能器
页数 文件大小 规格书
10页 227K
描述
CMOS Sensor, Rectangular, Through Hole Mount, CERAMIC, 22 PIN

G11135-512DE 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.72
其他特性:IT HAS SENSITIVITY 0.82 A/W阵列类型:LINEAR
主体宽度:15.1 mm主体长度或直径:31.8 mm
数据速率:5 Mbps动态范围:67.23 dB
外壳:CERAMIC安装特点:THROUGH HOLE MOUNT
最大工作电流:80 mA最高工作温度:60 °C
最低工作温度:-10 °C输出类型:DIGITAL VOLTAGE
封装形状/形式:RECTANGULAR像素大小:25X25 µm
传感器/换能器类型:IMAGE SENSOR,CMOS最大供电电压:5.3 V
最小供电电压:4.7 V表面贴装:NO
端接类型:SOLDERBase Number Matches:1

G11135-512DE 数据手册

 浏览型号G11135-512DE的Datasheet PDF文件第2页浏览型号G11135-512DE的Datasheet PDF文件第3页浏览型号G11135-512DE的Datasheet PDF文件第4页浏览型号G11135-512DE的Datasheet PDF文件第5页浏览型号G11135-512DE的Datasheet PDF文件第6页浏览型号G11135-512DE的Datasheet PDF文件第7页 
InGaAs linear image sensors  
G11135-256DD, G11135-512DE  
Single video line (256/512 pixels)  
near infrared image sensor (0.95 to 1.7 μm)  
The G11135 series InGaAs linear image sensors designed for foreign object inspection equipment. These linear image sensors  
consist of an InGaAs photodiode array and CMOS chip that contains a charge amplier array, an offset compensation circuit,  
a shift register, and a timing generator. The InGaAs photodiode array and the CMOS chip are electrically connected by indium  
bumps.  
The charge amplier array is made up of CMOS transistors connected to each pixel of the InGaAs photodiode array.  
Signals from each pixel are read out in charge integration mode to achieve high sensitivity and stable operation in the near  
infrared spectral range.  
The signal processing circuit on the CMOS chip offers two levels of conversion efciency (CE) that can be selected by the ex-  
ternal voltage to meet the application.  
Features  
Applications  
Single video line (256/512 pixels)  
High-speed data rate: 5 MHz max.  
Choice of two conversion efciency levels  
Foreign object screening  
Agricultural product inspection  
Related products  
Pixel size: G11135-256DD (50 × 50 μm)  
G11135-512DE (25 × 25 μm)  
Driver circuit for InGaAs liner image sensor C11514  
Built-in temperature sensor  
Small variations in dark output between pixels  
Room temperature operation  
General ratings  
Parameter  
G11135-256DD  
G11135-512DE  
Unit  
Cooling  
Non-cooled  
-
Number of total pixels  
Number of effective pixels  
Image size  
Pixel size  
Pixel pitch  
256  
256  
12.8 × 0.05  
50 × 50  
50  
pixels  
pixels  
mm  
512  
512  
12.8 × 0.025  
25 × 25  
25  
μm (H) × μm (V)  
μm  
Package  
Window material  
22-pin ceramic (refer to the dimensional outline)  
Borosilicate glass with anti-reective coating  
-
-
Cross sectional image  
InGaAs photodiode array  
Window  
CMOS chip  
Bump  
Wire bonding  
KMIRC0053EA  
1
www.hamamatsu.com  

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