APPLICABLE STANDARD
Operating
Storage
Temperature Range
Storage
-10 C to +60 C(2)
-55 C to +105 C(1)
100 V AC
Temperature Range
Voltage
Current
Rating
Relative humidity 85 % MAX
(Not dewed)
Humidity Range
Operating
0.5 A
Humidity Range
SPECIFICATIONS
ITEM
TEST METHOD
REQUIREMENTS
QT AT
CONSTRUCTION
General Examination
Marking
Visually and by measuring instrument.
Confirmed visually.
According to drawing.
×
×
×
×
ELECTRIC CHARACTERISTICS
30 m MAX (3)
1000 M MIN
Contact Resistance
Insulation Resistance
Voltage Proof
100 mA(DC or 1000 Hz)
×
×
×
-
-
-
250 V DC
300 V AC for 1 min.
No flashover or breakdown.
1
MECHANICAL CHARACTERISTICS
Insertion and
Measured by applicable connector.
Insertion Force: 26.7 N MAX
Withdrawal Force: 2.7 N MIN
×
×
-
-
Withdrawal Forces
Mechanical Operation
1)Contact Resistance
:
40 m MAX (3)
100 times insertions and extractions.
2)No damage, crack and looseness of
parts.
1)No electrical discontinuity of 1 s.
2)No damage, crack and looseness of
parts.
Vibration
Shock
Frequency 10 to 55 to 10 Hz, approx 5 min.
Single amplitude: 0.75 mm, 10 cycles
for 3 axial directions.
490 m/s2, duration of pulse 11 ms
×
×
-
-
at 3 times for 3 both axial directions.
ENVIRONMENTAL CHARACTERISTICS
Damp Heat
Exposed at 40 ± 2 C, 90 to 95 %, 96 h.
1)Contact Resistance
:
40 m MAX (3)
×
×
-
-
2)Insulation Resistance: 1000 M MIN
3)No damage, crack and looseness of
parts.
(Steady state)
Rapid Change of
Temperature
Temperature: -55 → +85 C
Time : 30 → 30 min.
Under 5 cycles.
(Relocation time to chamber: within 2 to 3 MIN)
Exposed at +105 C, 96 h
1)Contact Resistance
:
40 m MAX (3)
Dry Heat
Cold
×
-
2)No damage, crack and looseness of
parts.
Exposed at -55 C, 96 h
×
×
-
-
Resistance to
Soldering Heat
1)Reflow soldering:
No deformation of case of excessive
looseness of the terminal.
Peak TMP: 260 C MAX
Reflow TMP: 220 C MIN for 60 sec
2)Soldering irons: 360 C MAX for 5 sec.
Solderability
Soldered at solder temperature
240 ± 3 C for immersion duration, 3 sec.
A new uniform coating of solder shall
cover a minimum of 95 % of the surface
being immersed.
×
-
COUNT
DESCRIPTION OF REVISIONS
DIS-F-00003292
DESIGNED
MT.ITANO
CHECKED
DATE
1
△
2
HT.YAMAGUCHI
NH.NAKATA
18.04.16
17.11.01
17.10.31
17.10.31
17.10.31
REMARKS
APPROVED
CHECKED
DESIGNED
DRAWN
(1)Include temperature rise caused by current-carrying.
MK.NAGATA
(2)"Storage" means a long-term storage state for the unpacked part before assembly to pcb.
(3)Contact resistance of relay board is not included. It becomes contact resistance for 1 connector.
KJ.NISHIWAKI
KJ.NISHIWAKI
1
Unless otherwise specified, refer to IEC 60512.
Note QT:Qualification Test AT:Assurance Test X:Applicable Test
ELC-376551-00-00
FX27-40S-0.8SV
DRAWING NO.
PART NO.
CODE NO.
SPECIFICATION SHEET
HIROSE ELECTRIC CO., LTD.
△
1 1/1
CL577-1002-0-00
FORM HD0011-2-1