APPLICABLE STANDARD
Storage
Temperature Range
Operating
-40 C to 60 C (2)
-55 C to 85 C (1)
Temperature Range
Storage Humidity Range
Operating Humidity Range
Voltage
50 V AC/DC
Rating
Relative humidity 85% max
(Not dewed)
Current
0.4 A
SPECIFICATIONS
ITEM
TEST METHOD
REQUIREMENTS
QT AT
CONSTRUCTION
General Examination
Visually and by measuring instrument.
Confirmed visually.
According to drawing.
×
×
×
×
Marking
ELECTRIC CHARACTERISTICS
Contact Resistance
Insulation Resistance
100 mA(DC or 1000Hz)
60mΩ MAX.
×
×
×
-
-
-
100 V DC.
50 MΩMIN.
Voltage Proof
200 V AC for 1 min.
No flashover or breakdown.
MECHANICAL CHARACTERISTICS
Insertion and
Measured by applicable connector.
Insertion Force:
Withdrawal Force:
① Contact Resistance : 80mΩ MAX.
② No damage, crack and looseness of parts.
① No electrical discontinuity of 1 s.
36 N MAX.
4.8 N MIN.
×
×
×
-
-
-
Withdrawal Forces
Mechanical Operation
10 times insertions and extractions.
Vibration
Shock
Frequency 10 to 55 to 10Hz, approx 5min
Single amplitude : 0.75 mm, 10 cycles
for 3 axial directions.
490 m/s2 , duration of pulse 11 ms
at 3 times for 3 both axial directions.
② No damage, crack and looseness of parts.
×
-
ENVIRONMENTAL CHARACTERISTICS
Damp Heat
(Steady state)
Exposed at 40±2 C, 90 ~ 95 %, 96±4 h.
① Contact Resistance : 80mΩ MAX.
② Insulation Resistance : 50 M MIN.
③ No damage, crack and looseness of parts.
×
×
-
-
Rapid Change of
Temperature
Temperature
Time
-55
30
→
→
+85 C
30 min.
under
5 cycles.
(Relocation time to chamber : within 2~3 MIN)
Cold
Dry Heat
Sulfur Dioxide
Exposed at -55℃, 96±4 h
Exposed at 85℃, 96±4 h
Exposed at 25±2℃, 75±5%RH, 25±5 PPM
for 96±4 h.
① Contact Resistance : 80mΩ MAX.
② No damage, crack and looseness of parts.
Contact Resistance : 80mΩ MAX.
×
×
×
-
-
-
(Test standard: IEC 68)
Resistance to
Soldering Heat
1)Reflow soldering :
Peak TMP : 260℃MAX
Reflow TMP: 220℃MIN for 60sec
2) Soldering irons : 360℃ MAX. for 5 sec.
No deformation of case of excessive looseness
of the terminal.
×
×
-
-
Solderability
Soldered at solder temperature
240±3℃ for immersion duration, 3 sec.
A new uniform coating of solder shall cover a
minimum of 95 % of the surface being
immersed.
COUNT
DESCRIPTION OF REVISIONS
DESIGNED
CHECKED
DATE
0
△
(1) Include temperature rise caused by current-carrying.
(2) “STORAGE” means a long-term storage state for the unused product
REMARKS
APPROVED
CHECKED
DESIGNED
DRAWN
HT.YAMAGUCHI
HT.YAMAGUCHI
YY.YOSHIHARA
YY.YOSHIHARA
20200406
20200406
20200403
20200403
before assembly to PCB.
.
Unless otherwise specified, refer to IEC 60512.
Note QT:Qualification Test AT:Assurance Test X:Applicable Test
DRAWING NO.
PART NO.
ELC-369481-00-00
FX25-80P-0.4SV
SPECIFICATION SHEET
0
2/1
HIROSE ELECTRIC CO., LTD.
CODE NO.
CL575-4002-0-005
△
FORM HD0011-2-1
△