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FX25-80P-0.4SV PDF预览

FX25-80P-0.4SV

更新时间: 2024-09-30 18:10:07
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广濑 - HRS 连接器
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描述
连接器类型:插头;传输速度:2.5 Gbps;开口间距:0.4 mm;安装间距:0.4 mm;PIN数:80;浮动设计:有;插拔次数:10;安装方法:SMT;开口方向:笔直;接触部电镀:金;额定电

FX25-80P-0.4SV 数据手册

  
APPLICABLE STANDARD  
Storage  
Temperature Range  
Operating  
-40 C to 60 C (2)  
-55 C to 85 C (1)  
Temperature Range  
Storage Humidity Range  
Operating Humidity Range  
Voltage  
50 V AC/DC  
Rating  
Relative humidity 85% max  
(Not dewed)  
Current  
0.4 A  
SPECIFICATIONS  
ITEM  
TEST METHOD  
REQUIREMENTS  
QT AT  
CONSTRUCTION  
General Examination  
Visually and by measuring instrument.  
Confirmed visually.  
According to drawing.  
×
×
×
×
Marking  
ELECTRIC CHARACTERISTICS  
Contact Resistance  
Insulation Resistance  
100 mA(DC or 1000Hz)  
60mΩ MAX.  
×
×
×
100 V DC.  
50 MΩMIN.  
Voltage Proof  
200 V AC for 1 min.  
No flashover or breakdown.  
MECHANICAL CHARACTERISTICS  
Insertion and  
Measured by applicable connector.  
Insertion Force:  
Withdrawal Force:  
Contact Resistance : 80mΩ MAX.  
No damage, crack and looseness of parts.  
No electrical discontinuity of 1 s.  
36 N MAX.  
4.8 N MIN.  
×
×
×
Withdrawal Forces  
Mechanical Operation  
10 times insertions and extractions.  
Vibration  
Shock  
Frequency 10 to 55 to 10Hz, approx 5min  
Single amplitude : 0.75 mm, 10 cycles  
for 3 axial directions.  
490 m/s2 , duration of pulse 11 ms  
at 3 times for 3 both axial directions.  
No damage, crack and looseness of parts.  
×
ENVIRONMENTAL CHARACTERISTICS  
Damp Heat  
(Steady state)  
Exposed at 40±2 C, 90 95 %, 96±4 h.  
Contact Resistance : 80mΩ MAX.  
Insulation Resistance : 50 MMIN.  
No damage, crack and looseness of parts.  
×
×
Rapid Change of  
Temperature  
Temperature  
Time  
-55  
30  
+85 C  
30 min.  
under  
5 cycles.  
(Relocation time to chamber : within 23 MIN)  
Cold  
Dry Heat  
Sulfur Dioxide  
Exposed at -55, 96±4 h  
Exposed at 85, 96±4 h  
Exposed at 25±2, 75±5%RH, 25±5 PPM  
for 96±4 h.  
Contact Resistance : 80mΩ MAX.  
No damage, crack and looseness of parts.  
Contact Resistance : 80mΩ MAX.  
×
×
×
(Test standard: IEC 68)  
Resistance to  
Soldering Heat  
1)Reflow soldering :  
Peak TMP : 260MAX  
Reflow TMP: 220MIN for 60sec  
2) Soldering irons : 360MAX. for 5 sec.  
No deformation of case of excessive looseness  
of the terminal.  
×
×
Solderability  
Soldered at solder temperature  
240±3for immersion duration, 3 sec.  
A new uniform coating of solder shall cover a  
minimum of 95 % of the surface being  
immersed.  
COUNT  
DESCRIPTION OF REVISIONS  
DESIGNED  
CHECKED  
DATE  
0
(1) Include temperature rise caused by current-carrying.  
(2) “STORAGE” means a long-term storage state for the unused product  
REMARKS  
APPROVED  
CHECKED  
DESIGNED  
DRAWN  
HT.YAMAGUCHI  
HT.YAMAGUCHI  
YY.YOSHIHARA  
YY.YOSHIHARA  
20200406  
20200406  
20200403  
20200403  
before assembly to PCB.  
.
Unless otherwise specified, refer to IEC 60512.  
Note QT:Qualification Test AT:Assurance Test X:Applicable Test  
DRAWING NO.  
PART NO.  
ELC-369481-00-00  
FX25-80P-0.4SV  
SPECIFICATION SHEET  
0
2/1  
HIROSE ELECTRIC CO., LTD.  
CODE NO.  
CL575-4002-0-005  
FORM HD0011-2-1  

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