Datasheet > FX25-110S-0.4SH

FX25-110S-0.4SH

更新时间： 2024-11-02 18:08:59

品牌	Logo	应用领域
广濑 - HRS		插座连接器
页数	文件大小	规格书
1页	138K
描述
连接器类型:插座;传输速度:2.5 Gbps;开口间距:0.4 mm;安装间距:0.4 mm;PIN数:110;浮动设计:无;插拔次数:10;安装方法:SMT;开口方向:直角;接触部电镀:金;额定

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中文翻译

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数据手册

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FX25-110S-0.4SH 数据手册

APPLICABLE STANDARD

Storage

Temperature Range

Operating

-40 C to 60 C ⁽²⁾

-55 C to 85 C ⁽¹⁾

Temperature Range

Storage Humidity Range

Operating Humidity Range

Voltage

50 V AC/DC

Rating

_{Relative humidity}85_{% max}

(Not dewed)

Current

0.4 A

SPECIFICATIONS

ITEM

TEST METHOD

REQUIREMENTS

QT AT

CONSTRUCTION

General Examination

Visually and by measuring instrument.

Confirmed visually.

According to drawing.

Marking

ELECTRIC CHARACTERISTICS

Contact Resistance

Insulation Resistance

100 mA(DC or 1000Hz)

60mΩ MAX.

－

100 V DC.

50 MΩMIN.

Voltage Proof

200 V AC for 1 min.

No flashover or breakdown.

MECHANICAL CHARACTERISTICS

Insertion and

Measured by applicable connector.

Insertion Force:

Withdrawal Force:

① Contact Resistance : 80mΩ MAX.

② No damage, crack and looseness of parts.

① No electrical discontinuity of 1 s.

49.5 N MAX.

6.6 N MIN.

－

Withdrawal Forces

Mechanical Operation

10 times insertions and extractions.

Vibration

Shock

Frequency 10 to 55 to 10Hz, approx 5min

Single amplitude : 0.75 mm, 10 cycles

for 3 axial directions.

490 m/s², duration of pulse 11 ms

at 3 times for 3 both axial directions.

② No damage, crack and looseness of parts.

－

ENVIRONMENTAL CHARACTERISTICS

Damp Heat

(Steady state)

Exposed at 40±2 C, 90 ～ 95 %, 96±4 h.

① Contact Resistance : 80mΩ MAX.

② Insulation Resistance : 50 M MIN.

③ No damage, crack and looseness of parts.

－

Rapid Change of

Temperature

Time

-55

→

+85 C

30 min.

under

5 cycles.

(Relocation time to chamber : within 2～3 MIN)

Cold

Dry Heat

Sulfur Dioxide

Exposed at -55℃, 96±4 h

Exposed at 85℃, 96±4 h

Exposed at 25±2℃, 75±5%RH, 25±5 PPM

for 96±4 h.

① Contact Resistance : 80mΩ MAX.

② No damage, crack and looseness of parts.

Contact Resistance : 80mΩ MAX.

－

(Test standard: IEC 68)

Resistance to

Soldering Heat

1)Reflow soldering :

Peak TMP : 260℃MAX

Reflow TMP: 220℃MIN for 60sec

2) Soldering irons : 360℃ MAX. for 5 sec.

No deformation of case of excessive looseness

of the terminal.

－

Solderability

Soldered at solder temperature

240±3℃ for immersion duration, 3 sec.

A new uniform coating of solder shall cover a

minimum of 95 % of the surface being

immersed.

COUNT

DESCRIPTION OF REVISIONS

DESIGNED

CHECKED

DATE

△

⁽¹⁾Include temperature rise caused by current-carrying.

⁽²⁾“STORAGE” means a long-term storage state for the unused product

REMARKS

APPROVED

CHECKED

DESIGNED

DRAWN

HT.YAMAGUCHI

YY.YOSHIHARA

20190829

before assembly to PCB.

Unless otherwise specified, refer to IEC 60512.

Note QT:Qualification Test AT:Assurance Test X:Applicable Test

DRAWING NO.

PART NO.

ELC-368985-00-00

FX25-110S-0.4SH

SPECIFICATION SHEET

△

1/1

HIROSE ELECTRIC CO., LTD.

CODE NO.

CL575-4101-0-00

FORM HD0011-2-1

中文翻译

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