Datasheet > FX11LA-60S8-SV21

FX11LA-60S8-SV21

更新时间： 2024-11-21 02:27:15

品牌	Logo	应用领域
广濑 - HRS		/
页数	文件大小	规格书
8页	545K
描述
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections

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FX11LA-60S8-SV21 数据手册

NEW

0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections

FX11L Series

■Cross-Section of Mating

■Features

1. Low Profile Design

The board to board mating height of 2 mm suits smaller,thinner

case designs.

2. Improved Transmission Efficiency Between

Boards

Transmission characteristics have been improved through

a design that fixes ground plates to both sides of the

header and receptacle.

3. 10 Signal:1 Ground Arrangement

Signal and ground are arranged in a ratio of 10:1 with the

ground plate SMT connected to the board. The ground

stability achieved serves to reduce noise.

4. Reinforced Fittings for Added Solder Weld

Strength

Reinforced fittings provide greater adhesion to the

board,protecting against peeling.The unique connector

design provides a connection between the fitting and the

ground plate for a stronger ground.

Detailed Figure of Solder Gap

5. Suited to High-Density Applications

The signal contact pitch of 0.5mm produces a smaller

connector utilizing less board area for mounting.

6. Structure Prevents Solder Wicking

A solder gap has been designed into the contact SMT

portion to prevent solder wicking.

7. Optional Ground Plate

An alternate style without the ground plate is available.The

space provided by the ground plate removal has been filled

with additional signal contacts.

Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.

■Applications

Notebook computers, PDA, and other miniature electronic equipment.

2003.7

12 3 4 5 6 7 8

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