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FX11B-60P/6-SV(91) PDF预览

FX11B-60P/6-SV(91)

更新时间： 2024-11-18 18:10:07
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广濑 - HRS PC连接器
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描述
连接器类型:插头;传输规格:PCIe Gen.4;传输速度:16.0 Gbps;开口间距:0.5 mm;安装间距:0.5 mm;嵌合高度(Min.):2.5 mm;嵌合高度(Max.):2.5 m

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中文翻译

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FX11B-60P/6-SV(91) 数据手册

  
APPLICABLE STANDARD  
Operating  
Operating Humidity Relative humidity 95 % MAX  
Range  
(1)  
-55 C to 85 C  
50 V AC  
Temperature Range  
(Not dewed)  
Storage  
Temperature Range  
(2)  
Voltage  
-10 C to 60 C  
Rating  
Storage Humidity Relative humidity 85 % MAX(2)  
Range  
0.3 A  
Current  
(Not dewed)  
SPECIFICATIONS  
ITEM  
TEST METHOD  
REQUIREMENTS  
QT AT  
CONSTRUCTION  
According to drawing.  
Visually and by measuring instrument.  
Confirmed visually.  
General Examination  
Marking  
×
×
×
×
ELECTRIC CHARACTERISTICS  
100 mA(DC or 1000 Hz)  
70 mΩ MAX.  
Contact Resistance  
Insulation Resistance  
Voltage Proof  
×
×
×
－
－
×
100 MΩ MIN.  
100 V DC  
No flashover or breakdown.  
150 V AC for 1 min.  
MECHANICAL CHARACTERISTICS  
Measured by applicable connector.  
Insertion Force: 54.0 N MAX.  
Withdrawal Force: 3.6 N MIN.  
Insertion and  
Withdrawal Forces  
Mechanical Operation  
×
×
－
－
50 times insertions and extractions.  
1)Contact Resistance: 80 mΩ MAX.  
2)No damage, crack and looseness  
of parts.  
1)No electrical discontinuity of 1 s.  
2)No damage, crack and looseness  
of parts.  
Frequency 10 to 55 to 10 Hz, approx 5 min  
Single amplitude: 0.75 mm, 10 cycles  
for 3 axial directions.  
490 m/s2 , duration of pulse 11 ms  
Vibration  
Shock  
×
×
－
－
at 3 times for 3 both axial directions.  
ENVIRONMENTAL CHARACTERISTICS  
Exposed at 40 ± 2 C, 90 to 95 %, 96 h.  
1)Contact Resistance: 80 mΩ MAX.  
2)Insulation Resistance: 100 MΩ MIN.  
3)No damage, crack and looseness  
of parts.  
Damp Heat  
×
×
－
－
(Steady state)  
Rapid Change of  
Temperature  
Temperature -55 → +85 C  
Time 30 → 30 min.  
under 5 cycles.  
(Relocation time to chamber:within 2 to 3 min)  
Exposed at -55 C, 96 h.  
1)Contact Resistance: 80 mΩ MAX.  
2)No damage, crack and looseness  
of parts.  
Cold  
×
×
－
－
Exposed at 85 C, 96 h.  
Dry Heat  
Exposed in 5 % salt water spray for 48 h.  
No defect such as corrosion which  
impairs the function of connector.  
1)No defect such as corrosion which  
impairs the function of connector.  
2)Contact Resistance: 80 mΩ MAX.  
No deformation of case of excessive  
looseness of the terminal.  
Corrosion Salt Mist  
Sulfur Dioxide  
×
×
－
－
Exposed in 10 PPM for 96 h.  
(Test standard:IEC 68)  
1)Reflow soldering  
Resistance to  
Soldering Heat  
×
×
－
－
Peak TMP: 250 C MAX  
Reflow TMP: 220 C MIN for 60 sec.  
2)Soldering irons: 360 C MAX for 5 sec.  
Soldered at solder temperature  
240 ± 3 C for immersion duration, 3 sec.  
A new uniform coating of solder shall  
cover a minimum of 95 % of the surface  
being immersed.  
Solderability  
COUNT  
DESCRIPTION OF REVISIONS  
DESIGNED  
CHECKED  
DATE  
0
△
REMARK  
APPROVED  
CHECKED  
DESIGNED  
DRAWN  
NH.NAKATA  
HT.YAMAGUCHI  
MT.ITANO  
16.05.17  
16.05.17  
16.05.17  
16.05.17  
(1)Include temperature rise caused by current-carrying.  
(2)”STORAGE” means a long-term storage state for the unused product  
before assembly to PCB.  
MT.ITANO  
Unless otherwise specified, refer to IEC 60512.  
Note QT:Qualification Test,AT:Assurance Test,X:Applicable Test  
ELC-152601-91-00  
DRAWING NO.  
FX11B-60P/6-SV(91)  
CL573-0512-3-91  
PART NO.  
CODE NO.  
SPECIFICATION SHEET  
HIROSE ELECTRIC CO., LTD.  
0 1/1  
△
FORM HD0011-2-1  
1

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