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FST3383MTC PDF预览

FST3383MTC

更新时间: 2024-11-29 23:16:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关
页数 文件大小 规格书
5页 54K
描述
10-Bit Low Power Bus-Exchange Switch

FST3383MTC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP, TSSOP24,.25
针数:24Reach Compliance Code:unknown
风险等级:5.34其他特性:TTL COMPATIBLE BUS SWITCH
系列:CBT/FST/QS/5C/BJESD-30 代码:R-PDSO-G24
JESD-609代码:e3长度:7.8 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS EXCHANGER
位数:10功能数量:1
端口数量:4端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP24,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V传播延迟(tpd):0.25 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Other Logic ICs最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4 V标称供电电压 (Vsup):4.75 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mm

FST3383MTC 数据手册

 浏览型号FST3383MTC的Datasheet PDF文件第2页浏览型号FST3383MTC的Datasheet PDF文件第3页浏览型号FST3383MTC的Datasheet PDF文件第4页浏览型号FST3383MTC的Datasheet PDF文件第5页 
December 1993  
Revised May 1999  
FST3383  
10-Bit Low Power Bus-Exchange Switch  
General Description  
Features  
The FST3383 provides two sets of high-speed CMOS TTL-  
compatible bus switches. The low on resistance of the  
switch allows inputs to be connected to outputs without  
adding propagation delay or generating additional ground  
bounce noise. The device operates as a 10-bit bus switch  
or a 5-bit bus exchanger. The bus exchange (BX) signal  
provides nibble swapping of the AB and CD pairs of sig-  
nals. This exchange configuration allows byte swapping of  
buses in systems. It can also be used as a quad 2-to-1  
multiplexer and to create low delay barrel shifters. The bus  
enable (BE) signal turns the switches ON.  
5switch connection between two ports  
Zero propagation delay  
Ultra low power with 0.2 µA typical ICC  
Zero ground bounce in flow-through mode  
Control inputs compatible with TTL level  
Ordering Code:  
Order Number  
FST3383WM  
FST3383QSC  
FST3383MTC  
Package Number  
M24B  
Package Description  
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide  
24-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150 Wide  
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
MQA24  
MTC24  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Logic Diagram  
Connection Diagram  
Pin Descriptions  
Truth Table  
Pin Names  
Description  
A0–A4  
B0–B4  
BE BX  
Function  
Bus Switch Enable  
BE  
H
L
L
X
L
High-Z State High-Z State Disconnect  
BX  
Bus Exchange  
Buses A, B  
C0–C4  
D0– D4  
C0–C4  
Connect  
A0–A4, B0–B4  
C0–C4, D0–D4  
H
D0–D4  
Exchange  
Buses C, D  
© 1999 Fairchild Semiconductor Corporation  
DS011652.prf  
www.fairchildsemi.com  

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