是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | SC-70 |
包装说明: | TSSOP, TSSOP6,.08 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 3.07 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 167535 | Samacsys Pin Count: | 6 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | SOT23 (6-Pin) |
Samacsys Footprint Name: | SC-70 | Samacsys Released Date: | 2020-03-12 06:01:57 |
Is Samacsys: | N | 其他特性: | 2:1 MULTIPLEXER/DEMULTIPLEXER BUS SWITCH |
模拟集成电路 - 其他类型: | SPDT | JESD-30 代码: | R-PDSO-G6 |
JESD-609代码: | e3 | 长度: | 2 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 6 |
标称断态隔离度: | 57 dB | 通态电阻匹配规范: | 0.5 Ω |
最大通态电阻 (Ron): | 30 Ω | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出: | COMMON OUTPUT |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP6,.08 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.8/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Multiplexer or Switches |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 2.3 V | 表面贴装: | YES |
最长断开时间: | 7 ns | 最长接通时间: | 13 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.25 mm | Base Number Matches: | 1 |
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