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FSA2257MTCX PDF预览

FSA2257MTCX

更新时间: 2024-02-05 00:49:20
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 复用器开关复用器或开关信号电路光电二极管输出元件
页数 文件大小 规格书
13页 665K
描述
Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch

FSA2257MTCX 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:TSSOP, TSSOP10,.19,20Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:1.3
模拟集成电路 - 其他类型:SPDTJESD-30 代码:S-PDSO-G10
JESD-609代码:e4长度:3 mm
湿度敏感等级:1信道数量:1
功能数量:2端子数量:10
标称断态隔离度:70 dB通态电阻匹配规范:0.7 Ω
最大通态电阻 (Ron):4.5 Ω最高工作温度:85 °C
最低工作温度:-40 °C输出:SEPARATE OUTPUT
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP10,.19,20封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8/5 V认证状态:Not Qualified
座面最大高度:1.1 mm子类别:Multiplexer or Switches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):2.7 V表面贴装:YES
最长断开时间:20 ns最长接通时间:50 ns
切换:BREAK-BEFORE-MAKE技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

FSA2257MTCX 数据手册

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January 2007  
FSA2257 Low RON Low-Voltage Dual SPDT  
Bi-Directional Analog Switch  
Features  
Description  
Maximum 1.15  
Ω
On Resistance (R ) for 4.5V Supply  
The FSA2257 is a high-performance bi-directional dual  
Single-Pole/Double-Throw (SPDT) analog switch. This  
switch can be configured as either a multiplexer or a de-  
multiplexer by select pins. The device features ultra-low  
RON of 1.3Ω maximum at 4.5V VCC and operates over  
the wide VCC range of 1.65V to 5.5V. The device is fabri-  
cated with submicron CMOS technology to achieve fast  
switching speeds and is designed for break-before-make  
operation. The select input is TTL-level compatible.  
ON  
0.3Ω Maximum RON Flatness for +5V Supply  
Space-Saving Pb-Free MicroPak™ Packaging  
Broad VCC Operating Range: 1.65V to 5.5V  
Fast Turn-on / Turn-off Time  
Break-Before-Make Enable Circuitry  
Over-Voltage Tolerant TTL-Compatible Control Input  
Applications  
Cell Phone  
PDA  
Ultra-Portable  
Ordering Information  
Package  
Number Pb-Free  
Product Code  
Packing  
Method  
Order Number  
Top Mark  
Package Description  
10-Lead MicroPak™,  
1.6 x 2.1mm  
5000 Units on  
Tape and Reel  
FSA2257L10X(1)  
MAC010A  
MTC14  
Yes  
EP  
14-Lead Thin Shrink Small  
Outline Package (TSSOP),  
JEDEC MO-153,  
2500 Units on  
Tape and Reel  
FSA2257MTCX(1)  
Yes  
FSA2257  
4.4mm Wide  
10-Lead Molded Small  
Outline Package (MSOP),  
JEDEC MO-187, 3.0mm  
FSA  
2257  
4000 Units on  
Tape and Reel  
FSA2257MUX(1)  
MUA101A  
Yes  
Note:  
1. Lead-free package per JEDEC J-STD-020B. Device available in tape and reel only.  
32Ω Earpiece  
Base Band  
Voice/Bell Ring  
Base Band  
Processors  
with Melody  
Ring  
Generation  
Amp  
8Ω Loud Speaker  
Select Pin  
FSA2257  
Figure 1. Block Diagram  
MicroPakis a trademark of Fairchild Semiconductor Corporation.  
© 2006 Fairchild Semiconductor Corporation  
FSA2257 Rev. 1.0.3  
www.fairchildsemi.com  

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