Datasheet > FR3GBFL

FR3GBFL

更新时间： 2024-09-30 14:53:07

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	1987K
描述
Tape&Reel: 5Kpcs/Reel;

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中文翻译

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数据手册

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FR3GBFL 数据手册

FR3GBFL THRU FR3MBFL

Features

• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates

Compliant. See Ordering Information)

• Glass Passivated Chip Junction

• Low Profile Package

• For Surface Mount Applications

• High Forward Surge Capability

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

3.0 Amp

Fast Recovery

Rectifier

400 to 1000 Volts

• Halogen Free. “Green” Device (Note 2)

Maximum Ratings

• Operating Junction Temperature Range: -55°C to +150°C

• Storage Temperature Range: -55°C to +150°C

• Typical Thermal Resistance(Note 3): 15°C/W Junction to Case

• Typical Thermal Resistance(Note 3): 20°C/W Junction to Lead

• Typical Thermal Resistance(Note 3): 60°C/W Junction to Ambient

SMBF

Maximum

Maximum DC

Maximum

RMS

Voltage

MCC

Part Number

Device

Marking

Recurrent

Peak Reverse

Voltage

Blocking

Voltage

Cathode Mark

FR3GBFL

FR3JBFL

FR3MBFL

FR3G

FR3J

FR3M

400V

600V

1000V

280V

420V

700V

400V

600V

1000V

(OHFWULFDOꢀ&KDUDFWHULVWLFVꢀ#ꢀꢁꢂ&ꢀ8QOHVVꢀ2WKHUZLVHꢀ6SHFL¿HG

Average Forward

Current

I_F(AV)

I_FSM

V_F

3.0A

T_L=75⁰C

Peak Forward Surge

Current

100A

1.30V

8.3ms,Half Sine

Maximum Instantaneous

Forward Voltage

I_F=3.0A;

T_J=25⁰C

DIMENSIONS

MIN MAX MIN MAX

INCHES

DIM

NOTE

Maximum DC Reverse

Current At Rated DC

Blocking Voltage

5.0μA

100μA

T_J=25⁰C

T_J=125⁰C

I_R

0.134 0.150 3.40 3.80

0.075 0.083 1.90 2.10

0.163 0.175 4.15 4.45

0.201 0.220 5.10 5.60

0.041 0.061 1.05 1.55

0.028 0.053 0.70 1.35

0.006 0.010 0.15 0.25

Maximum Reverse

Recovery Time

I_F=0.5A; I_R=1.0A;

FR3GBFL

FR3JBFL

FR3MBFL

t_rr

150ns

250ns

Irr=0.25A

500ns

Suggested Solder Pad Layout

Typical Junction

Capacitance

40pF

30pF

FR3GBFL

FR3JBFL~FR3MBFL

Measured at 1.0MHz

V_R=4.0V

2.2mm

C_J

4.3mm

Note:

1.Halogen free "Green"products are defined as those which contain <900ppm bromine,

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2.High Temperature Solder Exemptions Applied, See EU Directive Annex 7a.

3.Mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas.

1.9mm

Rev.3-1-10012021

1/3

MCCSEMI.COM

12 3

中文翻译

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