Datasheet > FR251G_05

FR251G_05

更新时间： 2022-11-05 09:49:29

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描述
GLASS PASSIVATED JUNCTION

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FR251G_05 数据手册

GLASS PASSIVATED JUNCTION

FAST RECOVERY RECTIFIERS

FR251G - FR257G-STR

PRV : 50 - 1000 Volts

Io : 2.5 Amperes

D2A

FEATURES :

* Glass passivated chip

* High current capability

* High reliability

1.00 (25.4)

MIN.

0.161 (4.1)

0.154 (3.9)

* Low reverse current

* Low forward voltage drop

* Fast switching for high efficiency

* Pb / RoHS Free

0.284 (7.2)

0.268 (6.8)

MECHANICAL DATA :

1.00 (25.4)

MIN.

0.040 (1.02)

0.0385 (0.98)

* Case : D2A Molded plastic

* Epoxy : UL94V-O rate flame retardant

* Lead : Axial lead solderable per MIL-STD-202,

Method 208 guaranteed

* Polarity : Color band denotes cathode end

* Mounting position : Any

Dimensions in inches and ( millimeters )

* Weight : 0.645 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Rating at 25 °C ambient temperature unless otherwise specified.

Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

FR257G

-STR

SYMBOL FR251G FR252G FR253G FR254G FR255G FR256G FR257G

UNIT

RATING

VRRM

VRMS

VDC

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

100

200

140

200

400

280

400

600

420

600

800

560

800

1000 1000

700

Maximum DC Blocking Voltage

100

1000 1000

Maximum Average Forward Current

IF(AV)

2.5

0.375"(9.5mm) Lead Length

Ta = 75 °C

Peak Forward Surge Current,

IFSM

8.3ms Single half sine wave superimposed

on rated load (JEDEC Method)

Maximum Peak Forward Voltage at IF = 2.5 A

1.3

Maximum DC Reverse Current

at Rated DC Blocking Voltage

Ta = 25 °C

Ta = 100 °C

IR(H)

Trr

500

Maximum Reverse Recovery Time ( Note 1 )

Typical Junction Capacitance ( Note 2 )

Junction Temperature Range

150

250

500

250

- 65 to + 150

°C

TSTG

Storage Temperature Range

Notes :

( 1 ) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.

( 2 ) Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC

Page 1 of 2

Rev. 02 : March 24, 2005

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