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FQU5N60CTU PDF预览

FQU5N60CTU

更新时间: 2024-11-19 12:28:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 1830K
描述
N-Channel QFET MOSFET 600 V, 2.8 A, 2.5 Ohm

FQU5N60CTU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-251
包装说明:ROHS COMPLIANT, IPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.9
雪崩能效等级(Eas):210 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):2.8 A
最大漏极电流 (ID):2.8 A最大漏源导通电阻:2.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):49 W最大脉冲漏极电流 (IDM):11.2 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQU5N60CTU 数据手册

 浏览型号FQU5N60CTU的Datasheet PDF文件第2页浏览型号FQU5N60CTU的Datasheet PDF文件第3页浏览型号FQU5N60CTU的Datasheet PDF文件第4页浏览型号FQU5N60CTU的Datasheet PDF文件第5页浏览型号FQU5N60CTU的Datasheet PDF文件第6页浏览型号FQU5N60CTU的Datasheet PDF文件第7页 
March 2013  
FQD5N60C / FQU5N60C  
N-Channel QFET MOSFET  
600 V, 2.8 A, 2.5 Ω  
Features  
Description  
2.8 A, 600 V, RDS(on) = 2.5 (Max) @VGS = 10 V,  
ID = 1.4 A  
This N-Channel enhancement mode power MOSFET is  
produced using Fairchild Semiconductor®’s proprietary  
planar stripe and DMOS technology. This advanced  
MOSFET technology has been especially tailored to reduce  
on-state resistance, and to provide superior switching  
performance and high avalanche energy strength. These  
devices are suitable for switched mode power supplies,  
active power factor correction (PFC), and electronic lamp  
ballasts.  
Low Gate Charge (Typ. 15 nC)  
Low Crss (Typ. 6.5 pF)  
100% Avalanche Tested  
RoHS compliant  
D
!
D
G!  
I-PAK  
FQU Series  
D-PAK  
FQD Series  
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQD5N60C / FQU5N60C  
Unit  
V
V
I
Drain-Source Voltage  
600  
2.8  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
1.8  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
11.2  
± 30  
210  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
2.8  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.9  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
Power Dissipation (T = 25°C)*  
2.5  
A
P
Power Dissipation (T = 25°C)  
49  
W
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.39  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
Max  
2.56  
50  
Unit  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
-
-
-
°C/W  
°C/W  
°C/W  
θJC  
θJA  
θJA  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2003 Fairchild Semiconductor Corporation  
FQD5N60C / FQU5N60C Rev. C0  
www.fairchildsemi.com  

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