TM
QFET
FQP5N50C/FQPF5N50C
500V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.
•
•
•
•
•
•
5A, 500V, R
= 1.4 Ω @V = 10 V
DS(on) GS
Low gate charge ( typical 18nC)
Low Crss ( typical 15pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
●
◀
▲
●
●
G!
TO-220F
FQPF Series
TO-220
FQP Series
G D
S
G
D S
!
S
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
FQP5N50C
FQPF5N50C
Units
V
V
I
Drain-Source Voltage
500
DSS
- Continuous (T = 25°C)
Drain Current
5
5 *
A
D
C
- Continuous (T = 100°C)
2.9
20
2.9 *
20 *
A
C
I
(Note 1)
Drain Current
- Pulsed
A
DM
V
E
I
Gate-Source Voltage
± 30
300
5
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
7.3
4.5
mJ
V/ns
W
AR
dv/dt
P
Power Dissipation (T = 25°C)
73
38
D
C
- Derate above 25°C
Operating and Storage Temperature Range
0.58
0.3
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FQP5N50C
FQPF5N50C
Units
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
1.71
0.5
3.31
--
θJC
θJS
62.5
62.5
θJA
©2003 Fairchild Semiconductor Corporation
Rev. A, April 2003