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FQP32N20C PDF预览

FQP32N20C

更新时间: 2024-11-25 22:25:15
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 1184K
描述
200V N-Channel MOSFET

FQP32N20C 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.7
雪崩能效等级(Eas):955 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):28 A
最大漏极电流 (ID):28 A最大漏源导通电阻:0.082 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):156 W
最大脉冲漏极电流 (IDM):112 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQP32N20C 数据手册

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QFET®  
FQP32N20C/FQPF32N20C  
200V N-Channel MOSFET  
General Description  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
Features  
28A, 200V, RDS(on) = 0.082@VGS = 10 V  
Low gate charge ( typical 82.5 nC)  
Low Crss ( typical 185 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters,  
switch mode power supplies, DC-AC converters for  
uninterrupted power supplies and motor controls.  
D
{
{
G
TO-220F  
TO-220  
G D  
S
G
D S  
FQPF Series  
FQP Series  
{
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
VDSS  
Parameter  
FQP32N20C  
FQPF32N20C  
200  
Units  
V
Drain-Source Voltage  
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
Drain Current  
28.0  
17.8  
112  
28.0 *  
17.8 *  
112 *  
A
A
A
IDM  
(Note 1)  
Drain Current  
VGSS  
EAS  
IAR  
EAR  
dv/dt  
PD  
Gate-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
± 30  
955  
28.0  
15.6  
5.5  
V
mJ  
A
mJ  
V/ns  
W
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
156  
50  
- Derate above 25°C  
Operating and Storage Temperature Range  
1.25  
0.4  
W/°C  
°C  
TJ, TSTG  
TL  
-55 to +150  
300  
Maximum lead temperature for soldering purposes,  
°C  
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
FQP32N20C  
FQPF32N20C  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.8  
0.5  
62.5  
2.51  
--  
62.5  
RθJS  
RθJA  
©2004 Fairchild Semiconductor Corporation  
Rev. A, March 2004  

FQP32N20C 替代型号

型号 品牌 替代类型 描述 数据表
STP55NF06 STMICROELECTRONICS

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