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FQI32N20C PDF预览

FQI32N20C

更新时间: 2024-11-03 22:25:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
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9页 911K
描述
200V N-Channel MOSFET

FQI32N20C 数据手册

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QFET®  
FQB32N20C/FQI32N20C  
200V N-Channel MOSFET  
General Description  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
Features  
28A, 200V, RDS(on) = 0.082@VGS = 10 V  
Low gate charge ( typical 82.5 nC)  
Low Crss ( typical 185 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction, electronic lamp ballasts  
based on half bridge topology.  
D
{
D
I2-PAK  
{
G
D2-PAK  
G
S
FQI Series  
FQB Series  
G D S  
{
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
VDSS  
Parameter  
FQB32N20C / FQI32N20C  
Units  
V
A
A
A
Drain-Source Voltage  
Drain Current  
200  
28.0  
17.8  
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
IDM  
(Note 1)  
Drain Current  
112  
VGSS  
EAS  
IAR  
EAR  
dv/dt  
Gate-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TA = 25°C)*  
± 30  
955  
28.0  
15.6  
5.5  
3.13  
156  
V
mJ  
A
mJ  
V/ns  
W
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
PD  
Power Dissipation (TC = 25°C)  
W
- Derate above 25°C  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
1.25  
-55 to +150  
W/°C  
°C  
TJ, TSTG  
TL  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
--  
Max  
0.8  
40  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
--  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2004 Fairchild Semiconductor Corporation  
Rev. A, March 2004  

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