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FQD13N10LTM PDF预览

FQD13N10LTM

更新时间: 2024-11-06 17:15:23
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
7页 752K
描述
种类:N-Channel;漏源电压(Vdss):100V;持续漏极电流(Id)(在25°C时):10A;Vgs(th)(V):±20;漏源导通电阻:180mΩ@10V

FQD13N10LTM 数据手册

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R
UMW  
FQD13N10L  
100V N-Channel MOSFET  
Description  
This advanced MOSFET technology has been especially  
tailored to reduce on-state resistance, and to provide  
superior switching performance and high avalanche  
energy strength. These devices are suitable for switched  
mode power supplies, audio amplifier, DC motor control,  
and variable switching power applications.  
D
G
S
Features  
VDS (V) = 100V  
ID = 10A (VGS = 10V)  
RDS(ON) <180m(VGS = 10V),ID = 5.0 A  
Absolute Maximum Ratings TC = 25°C unless otherwise noted.  
Symbol  
Parameter  
FQD13N10L  
Unit  
V
V
I
Drain-Source Voltage  
100  
10  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
6.3  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
40  
± 20  
95  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
10  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.0  
mJ  
V/ns  
W
AR  
dv/dt  
6.0  
Power Dissipation (T = 25°C)  
2.5  
P
A
D
Power Dissipation (T = 25°C)  
40  
W
C
- Derate above 25°C  
0.32  
-55 to +150  
W/°C  
°C  
T , T  
Operating and Storage Temperature Range  
J
STG  
Maximum Lead Temperature for Soldering,  
1/8from Case for 5 Seconds  
T
300  
°C  
L
Thermal Characteristics  
FQD13N10L  
Unit  
Symbol  
Parameter  
RJC  
RJA  
Thermal Resistance, Junction to Case, Max.  
3.13  
110  
50  
Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max.  
Thermal Resistance, Junction to Ambient (*1 in2 Pad of 2-oz Copper), Max.  
oC/W  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  

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