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FQB25N33 PDF预览

FQB25N33

更新时间: 2024-11-02 03:37:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 1035K
描述
330V N-Channel MOSFET

FQB25N33 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:8
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.72其他特性:FAST SWITCHING
雪崩能效等级(Eas):370 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:330 V
最大漏极电流 (Abs) (ID):25 A最大漏极电流 (ID):25 A
最大漏源导通电阻:0.23 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):250 W最大脉冲漏极电流 (IDM):100 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

FQB25N33 数据手册

 浏览型号FQB25N33的Datasheet PDF文件第2页浏览型号FQB25N33的Datasheet PDF文件第3页浏览型号FQB25N33的Datasheet PDF文件第4页浏览型号FQB25N33的Datasheet PDF文件第5页浏览型号FQB25N33的Datasheet PDF文件第6页浏览型号FQB25N33的Datasheet PDF文件第7页 
September 2006  
®
QFET  
FQB25N33  
330V N-Channel MOSFET  
Features  
General Description  
25A, 330V, RDS(on) = 0.23@VGS = 10V  
Low gate charge (typical 58nC)  
Low Crss (typical 40pF)  
Fast switching  
These N-Channel enhancement mode power field effect  
transistors are produced using Farichild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimized on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficient switched mode power supplies,  
active power factor correction, electronic lamp ballast  
based on half bridge topology.  
100% avalanche tested  
Improved dv/dt capability  
Qualified to AEC Q101  
RoHS Compliant  
Absolute Maximum Ratings  
Symbol  
Parameter  
FQB25N33  
330  
Units  
V
VDSS  
Drain-Source Voltage  
Drain Current  
- Continuous (TC = 25oC)  
- Continuous (TC = 100oC)  
- Pulsed  
25  
A
ID  
16.0  
100  
A
IDM  
Drain Current  
(Note 1)  
A
VGSS  
EAS  
IAR  
Gate -Source Voltage  
±30  
V
Single Pulse Avalanche Energy  
Avalanche Current  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
370  
mJ  
A
25  
EAR  
dv/dt  
Repetitive Avalance Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TA = 25oC) *  
Power Dissipation (TC = 25oC)  
37  
mJ  
V/ns  
W
4.5  
3.1  
PD  
250  
W
- Derate above 25oC  
2.0  
W/oC  
oC  
TJ, TSTG Operating and Storage Temperature  
-55 to +150  
Maximum lead temperature for soldering purposes,  
1/8 from case for 5 seconds  
TL  
300  
oC  
Thermal Characteristics  
Symbol  
Parameter  
FQB25N33  
Units  
oC/W  
oC/W  
oC/W  
RθJC  
Thermal Resistance, Junction to Case  
0.5  
40  
RθJA  
Thermal Resistance, Junction to Ambient *  
Thermal Resistance, Junction to Ambient  
RθJA  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2006 Fairchild Semiconductor Corporation  
1
www.fairchildsemi.com  
FQB25N33 Rev. A  

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