5秒后页面跳转
FMP16N50ES PDF预览

FMP16N50ES

更新时间: 2024-11-02 11:57:19
品牌 Logo 应用领域
富士电机 - FUJI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
5页 536K
描述
N-CHANNEL SILICON POWER MOSFET

FMP16N50ES 技术参数

生命周期:Active零件包装代码:TO-220AB
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.72Is Samacsys:N
其他特性:LOW NOISE雪崩能效等级(Eas):485 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):16 A最大漏极电流 (ID):16 A
最大漏源导通电阻:0.38 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):225 W最大脉冲漏极电流 (IDM):64 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FMP16N50ES 数据手册

 浏览型号FMP16N50ES的Datasheet PDF文件第2页浏览型号FMP16N50ES的Datasheet PDF文件第3页浏览型号FMP16N50ES的Datasheet PDF文件第4页浏览型号FMP16N50ES的Datasheet PDF文件第5页 
FMP16N50ES  
FUJI POWER MOSFET  
3S  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-E series  
Features  
Outline Drawings [mm]  
Equivalent circuit schematic  
Maintains both low power loss and low noise  
Lower RDS(on) characteristic  
TO-220AB  
More controllable switching dv/dt by gate resistance  
Smaller VGS ringing waveform during switching  
Narrow band of the gate threshold voltage (4.2±0.5V)  
High avalanche durability  
Drain(D)  
Gate(G)  
Applications  
Source(S)  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
Maximum Ratings and Characteristics  
Absolute Maximum Ratings at Tc=25°C (unless otherwise specified)  
Description  
Symbol  
Characteristics  
Unit  
V
Remarks  
VDS  
500  
500  
Drain-Source Voltage  
VDSX  
V
VGS = -30V  
Continuous Drain Current  
I
I
D
±16  
A
Pulsed Drain Current  
DP  
±64  
A
Gate-Source Voltage  
VGS  
±30  
V
Repetitive and Non-Repetitive Maximum Avalanche Current  
Non-Repetitive Maximum Avalanche Energy  
Repetitive Maximum Avalanche Energy  
Peak Diode Recovery dV/dt  
I
AR  
16  
A
Note*1  
Note*2  
Note*3  
Note*4  
E
E
AS  
AR  
485  
mJ  
mJ  
kV/µs  
A/µs  
22.5  
4.8  
dV/dt  
-di/dt  
Peak Diode Recovery -di/dt  
100  
Note*5  
2.02  
225  
Ta=25°C  
Tc=25°C  
Maximum Power Dissipation  
P
D
W
T
ch  
150  
°C  
°C  
Operating and Storage Temperature range  
Tstg  
-55 to + 150  
Electrical Characteristics at Tc=25°C (unless otherwise specified)  
Description  
Symbol  
Conditions  
min.  
typ.  
-
max.  
-
Unit  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
BVDSS  
I
I
D
=250µA, VGS=0V  
=250µA, VDS=VGS  
DS=500V, VGS=0V  
DS=400V, VGS=0V  
GS=±30V, VDS=0V  
500  
V
V
VGS (th)  
D
3.7  
4.2  
-
4.7  
25  
V
V
V
T
ch=25°C  
-
Zero Gate Voltage Drain Current  
I
DSS  
µA  
Tch=125°C  
-
-
250  
100  
0.38  
-
Gate-Source Leakage Current  
Drain-Source On-State Resistance  
Forward Transconductance  
Input Capacitance  
I
GSS  
-
10  
0.33  
11  
nA  
R
DS (on)  
I
I
D
=8A, VGS=10V  
=8A, VDS=25V  
-
g
fs  
D
5.5  
S
Ciss  
Coss  
Crss  
td(on)  
tr  
-
-
1700  
210  
13  
2550  
315  
19.5  
55.5  
45  
V
V
DS=25V  
GS=0V  
Output Capacitance  
pF  
ns  
f=1MHz  
Reverse Transfer Capacitance  
-
-
37  
30  
87  
17  
V
V
cc=300V  
GS=10V  
Turn-On Time  
Turn-Off Time  
-
I
D
=8A  
td(off)  
tf  
-
130.5  
25.5  
72  
R
GS=18Ω  
-
Total Gate Charge  
Q
Q
Q
Q
G
-
48  
17  
Vcc=250V  
Gate-Source Charge  
GS  
GD  
SW  
-
25.5  
27  
I
D
=16A  
nC  
Gate-Drain Charge  
-
18  
7
VGS=10V  
Gate-Drain Crossover Charge  
Avalanche Capability  
Diode Forward On-Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
-
10.5  
-
I
AV  
L=1.52mH, Tch=25°C  
16  
-
-
A
V
VSD  
I
F
=16A, VGS=0V, Tch=25°C  
0.90  
0.46  
6.0  
1.35  
-
trr  
-
µs  
µC  
I
F
=16A, VGS=0V  
-di/dt=100A/µs, Tch=25°C  
Qrr  
-
-
Thermal Characteristics  
Description  
Symbol  
Test Conditions  
Channel to Case  
Channel to Ambient  
min.  
typ.  
max.  
0.560  
62.0  
Unit  
°C/W  
°C/W  
Rth (ch-c)  
Rth (ch-a)  
Thermal resistance  
Note *1 : Tch≤150°C.  
Note *4 : I  
F
≤-I  
D
, -di/dt=100A/μs, Vcc≤BVDSS, Tch≤150°C.  
Note *2 : Stating Tch=25°C, IAS=7A, L=18.1mH, Vcc=50V, R  
G
=50Ω.  
Note *5 : I  
F
≤-I  
D, dv/dt=4.8kV/μs, Vcc≤BVDSS, Tch≤150°C.  
E
AS limited by maximum channel temperature and avalanche current.  
See to 'Avalanche Energy' graph.  
Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature.  
See to the 'Transient Themal impeadance' graph.  
1

FMP16N50ES 替代型号

型号 品牌 替代类型 描述 数据表
FMP16N50E FUJI

完全替代

N-CHANNEL SILICON POWER MOSFET
FMH16N50E FUJI

类似代替

Power Field-Effect Transistor, 16A I(D), 500V, 0.38ohm, 1-Element, N-Channel, Silicon, Met
FMH16N50ES FUJI

类似代替

N-CHANNEL SILICON POWER MOSFET

与FMP16N50ES相关器件

型号 品牌 获取价格 描述 数据表
FMP16N60E FUJI

获取价格

N-CHANNEL SILICON POWER MOSFET
FMP16N60ES FUJI

获取价格

N-CHANNEL SILICON POWER MOSFET
FMP18.48 BEL

获取价格

AC-DC Regulated Power Supply Module, ROHS COMPLIANT
FMP18N05 NSC

获取价格

POWER, FET
FMP18N05 TI

获取价格

TRANSISTOR,MOSFET,N-CHANNEL,50V V(BR)DSS,13A I(D),TO-220AB
FMP18N06 NSC

获取价格

POWER, FET
FMP1T-148 ROHM

获取价格

0.025A, 80V, 4 ELEMENT, SILICON, SIGNAL DIODE, MINIMOLD, FMT, 5 PIN
FMP1T149 ROHM

获取价格

Rectifier Diode, 4 Element, 0.025A, 80V V(RRM), Silicon,
FMP1T-149 ROHM

获取价格

0.025A, 80V, 4 ELEMENT, SILICON, SIGNAL DIODE, MINIMOLD, FMT, 5 PIN
FMP200 YAGEO

获取价格

High Power Flame-Proof type