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FLL101ME PDF预览

FLL101ME

更新时间: 2024-11-21 19:36:07
品牌 Logo 应用领域
富士通 - FUJITSU 局域网放大器晶体管
页数 文件大小 规格书
4页 52K
描述
RF Small Signal Field-Effect Transistor, 1-Element, L Band, Gallium Arsenide, N-Channel, Junction FET, HERMETIC SEALED, METAL CERAMIC, CASE ME, 3 PIN

FLL101ME 技术参数

生命周期:Obsolete包装说明:FLANGE MOUNT, R-MDFM-F2
针数:3Reach Compliance Code:unknown
风险等级:5.79其他特性:HIGH RELIABILITY
外壳连接:SOURCE配置:SINGLE
最小漏源击穿电压:15 VFET 技术:JUNCTION
最高频带:L BANDJESD-30 代码:R-MDFM-F2
元件数量:1端子数量:2
工作模式:DEPLETION MODE最高工作温度:175 °C
封装主体材料:METAL封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:4.16 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

FLL101ME 数据手册

 浏览型号FLL101ME的Datasheet PDF文件第2页浏览型号FLL101ME的Datasheet PDF文件第3页浏览型号FLL101ME的Datasheet PDF文件第4页 
FLL101ME  
L-Band Medium & High Power GaAs FETs  
FEATURES  
• High Output Power: P  
=29.5dBm (Typ.)  
1dB  
=13.5dB (Typ.)  
• High Gain: G  
1dB  
=47% (Typ.)  
• High PAE: h  
add  
• Proven Reliability  
• Hermetically Sealed Package  
DESCRIPTION  
The FLL101ME is a Power GaAs FET that is specifically designed to  
provide high power at L-Band frequencies with gain, linearity and  
efficiency superior to that of silicon devices. The performance in  
multitone environments for Class AB operation make them ideally suited  
for base station applications. This device is assembled in hermetic  
metal/ceramic package.  
Fujitsu’s stringent Quality Assurance Program assures the highest  
reliability and consistent performance.  
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25¡C)  
Item  
Symbol  
Condition  
Unit  
Rating  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
15  
-5  
V
V
DS  
GS  
T = 25¡C  
c
Total Power Dissipation  
Storage Temperature  
Channel Temperature  
P
4.16  
-65 to +175  
175  
W
¡C  
¡C  
t
T
stg  
T
ch  
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:  
1. The drain-source operating voltage (V ) should not exceed 10 volts.  
DS  
2. The forward and reverse gate currents should not exceed 1.0 and -0.5 mA respectively with  
gate resistance of 400W.  
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25¡C)  
Limit  
Typ.  
Item  
Symbol  
Test Conditions  
Unit  
Min.  
Max.  
V
V
V
I
= 5V, V  
= 5V, I  
= 0V  
GS  
Saturated Drain Current  
Transconductance  
I
-
300  
450  
-
mA  
DS  
DS  
DS  
DSS  
g
m
= 200mA  
= 15mA  
DS  
-
150  
mS  
V
DS  
Pinch-off Voltage  
V
= 5V, I  
-1.0  
-2.0 -3.5  
p
Gate Source Breakdown Voltage  
V
-
-
= -15µA  
-5  
V
GSO  
GS  
Output Power at 1dB G.C.P.  
P
1dB  
28.5 29.5  
12.5 13.5  
-
dBm  
V
= 10V  
DS  
I
» 0.6I  
DS  
f = 2.3GHz  
DSS (Typ.),  
-
Power Gain at 1dB G.C.P.  
Power-added Efficiency  
G
dB  
1dB  
h
-
-
-
47  
25  
%
add  
R
36  
Thermal Resistance  
Channel to Case  
¡C/W  
th  
G.C.P.: Gain Compression Point  
CASE STYLE: ME  
Data Sheets  
1998 Microwave Databook  
164  

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