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FIN1027K8X PDF预览

FIN1027K8X

更新时间: 2024-10-26 22:11:15
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器接口集成电路光电二极管
页数 文件大小 规格书
12页 948K
描述
3.3V LVDS 2-Bit High Speed Differential Driver

FIN1027K8X 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:3.10 MM, ROHS COMPLIANT, MO-187, US-8
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.56差分输出:YES
驱动器位数:2输入特性:STANDARD
接口集成电路类型:LINE DRIVER接口标准:EIA-644; TIA-644
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:2.3 mm湿度敏感等级:1
功能数量:2端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
最小输出摆幅:0.25 V封装主体材料:PLASTIC/EPOXY
封装代码:VSSOP封装等效代码:TSSOP8,.12,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:
座面最大高度:0.9 mm子类别:Line Driver or Receivers
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大传输延迟:1.5 ns宽度:2 mm
Base Number Matches:1

FIN1027K8X 数据手册

 浏览型号FIN1027K8X的Datasheet PDF文件第2页浏览型号FIN1027K8X的Datasheet PDF文件第3页浏览型号FIN1027K8X的Datasheet PDF文件第4页浏览型号FIN1027K8X的Datasheet PDF文件第5页浏览型号FIN1027K8X的Datasheet PDF文件第6页浏览型号FIN1027K8X的Datasheet PDF文件第7页 
April 2001  
Revised June 2003  
FIN1027 FIN1027A  
3.3V LVDS 2-Bit High Speed Differential Driver  
General Description  
Features  
This dual driver is designed for high speed interconnects  
utilizing Low Voltage Differential Signaling (LVDS) technol-  
ogy. The driver translates LVTTL signal levels to LVDS lev-  
els with a typical differential output swing of 350 mV which  
provides low EMI at ultra low power dissipation even at  
high frequencies. This device is ideal for high speed trans-  
fer of clock or data.  
Greater than 600Mbs data rate  
3.3V power supply operation  
0.5ns maximum differential pulse skew  
1.5ns maximum propagation delay  
Low power dissipation  
Power-Off protection  
The FIN1027 or FIN1027A can be paired with its compan-  
ion receiver, the FIN1028, or with any other LVDS receiver.  
Meets or exceeds the TIA/EIA-644 LVDS standard  
Flow-through pinout simplifies PCB layout  
8-Lead SOIC, US8, and 8-terminal MLP  
packages save space  
Ordering Code:  
Order Number Package Number  
Package Description  
FIN1027M  
M08A  
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
[TUBE]  
FIN1027MX  
FIN1027K8X  
M08A  
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
[TAPE and REEL]  
MAB08A  
MLP08C  
M08A  
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide  
[TAPE and REEL]  
FIN1027MPX  
(Preliminary)  
8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square  
[TAPE and REEL]  
FIN1027AM  
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
[TUBE]  
FIN1027AMX  
M08A  
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
[TAPE and REEL]  
© 2003 Fairchild Semiconductor Corporation  
DS500501  
www.fairchildsemi.com  

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