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FIN1025MTCX PDF预览

FIN1025MTCX

更新时间: 2024-10-27 12:58:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
7页 267K
描述
Line Driver, 2 Func, 2 Driver, PDSO14, 4.40 MM, MO-153, TSSOP-14

FIN1025MTCX 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:4.40 MM, MO-153, TSSOP-14
针数:14Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.49差分输出:YES
驱动器位数:2输入特性:STANDARD
接口集成电路类型:LINE DRIVER接口标准:EIA-644; TIA-644
JESD-30 代码:R-PDSO-G14JESD-609代码:e3
长度:5 mm湿度敏感等级:1
功能数量:2端子数量:14
最高工作温度:85 °C最低工作温度:-40 °C
最小输出摆幅:0.25 V输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
最大接收延迟:座面最大高度:1.2 mm
子类别:Line Driver or Receivers最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED最大传输延迟:1.7 ns
宽度:4.4 mmBase Number Matches:1

FIN1025MTCX 数据手册

 浏览型号FIN1025MTCX的Datasheet PDF文件第2页浏览型号FIN1025MTCX的Datasheet PDF文件第3页浏览型号FIN1025MTCX的Datasheet PDF文件第4页浏览型号FIN1025MTCX的Datasheet PDF文件第5页浏览型号FIN1025MTCX的Datasheet PDF文件第6页浏览型号FIN1025MTCX的Datasheet PDF文件第7页 
June 2002  
Revised June 2002  
FIN1025  
3.3V LVDS 2-Bit High Speed Differential Driver  
General Description  
Features  
Greater than 400Mbs data rate  
Flow-through pinout simplifies PCB layout  
3.3V power supply operation  
This dual driver is designed for high speed interconnects  
utilizing Low Voltage Differential Signaling (LVDS) technol-  
ogy. The driver translates LVTTL signal levels to LVDS lev-  
els with a typical differential output swing of 350mV which  
provides low EMI at ultra low power dissipation even at  
high frequencies. This device is ideal for high speed trans-  
fer of clock and data.  
0.4ns maximum differential pulse skew  
1.7ns maximum propagation delay  
Low power dissipation  
The FIN1025 can be paired with its companion receiver,  
the FIN1026, or any other LVDS receiver.  
Power-Off protection  
Meets or exceeds the TIA/EIA-644 LVDS standard  
14-Lead TSSOP package saves space  
Ordering Code:  
Order Number Package Number  
Package Description  
FIN1025MTC  
MTC14  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Connection Diagram  
Pin Descriptions  
Pin Name  
IN1, DIN2  
Description  
LVTTL Data Inputs  
D
,
DOUT1+, DOUT2+  
DOUT1, DOUT2−  
EN  
Non-Inverting Driver Outputs  
Inverting Driver Outputs  
Driver Enable Pin  
EN  
VCC  
GND  
NC  
Inverting Driver Enable Pin  
Power Supply  
Ground  
No Connect  
Truth Table  
Inputs  
Outputs  
DIN  
DOUT+  
DOUT−  
EN  
EN  
H
L or OPEN  
L or OPEN  
L or OPEN  
H
H
H
L
L
Z
Z
L
H
H
Z
Z
H
L
OPEN  
X
H
X
L or OPEN  
X
X
H = HIGH Logic Level  
L = LOW Logic Level  
X = Don’t Care  
Z = High Impedance  
© 2002 Fairchild Semiconductor Corporation  
DS500783  
www.fairchildsemi.com  

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