Datasheet > FI212C245032

FI212C245032

更新时间： 2024-11-21 20:10:31

品牌	Logo	应用领域
太诱 - TAIYO YUDEN		LTE
页数	文件大小	规格书
6页	247K
描述
Band Pass Filter

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

FI212C245032 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.59	滤波器类型：	BAND PASS FILTER
Base Number Matches：	1

FI212C245032 数据手册

Special Topic

Technical trends in filters for

These days we can see more and more applications being installed in communication

devices, W-LAN in notebook PCs, Bluetooth and digital terrestrial broadcasting

applications in cellular phones.

In the future, wireless communication and broadcasting technologies will continue

to further develop, and the wireless market which supports them , including wireless

components, will further expand as well.

In this ubiquitously connected society, ICs used in communication systems, and wireless

devices are required to be high-performance, smaller, and inexpensive.

In this article, we will explain ﬁlter processes, Taiyo Yuden's ﬁlter lineup, and notiﬁcation

for using ﬁlters in desigs in such wireless devices.

The materials of multilayer ﬁlters

Multilayer ceramics ﬁlters, which are used for

frequency bands ranging from several hundreds

MHz to several GHz, are composed of low-resist-

ance conductor materials, such as Ag and Cu, and

dielectric materials. The conductor materials are

mainly composed from Ag-based materials.

This dielectric material contains an Ag con-

ductor, so we use low temperature co-ﬁred

ceramic(LTCC) materials, which can be baked

The manufacturing process of

multilayer ﬁlters

Figure 1. Process-Flow Diagram

Mixing/Casting

The manufacturing process of ceramic compo-

nents for wireless application, such as multilayer

Cutting

Laminating

ﬁlters, is described in

. Except for the

Figure 1

Firing

Cutting Sheet

inspection process, multilayer ﬁlters can be pro-

duced by similar process ﬂow to other multilayer

components such as multilayer inductors.

Forming terminal

Making Via Hole

electrodes

Int. Conductor pattern

screening/printing

Plating

Inspection

Shipment

Filter characteristics are signiﬁcantly affected by

the accuracy of manufacturing processes. These

characteristics are the material dielectric constant,

thickness of dielectric layer, printing process,

Stacking/bonding

at 900 , rather than using capacitor's dielectric

℃

materials, which can be baked at 1,300

℃

2008

Taiyo Yuden Navigator

12 3 4 5 6

中文翻译

下载PDF

与FI212C245032相关器件

型号	品牌	获取价格	描述	数据表
FI212C245032-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s),
FI212C245033	TAIYO YUDEN	获取价格	Band Pass Filter,
FI212C245033-T	TAIYO YUDEN	获取价格	Multilayer Ceramic Devices (Balance Type)
FI212C245034	TAIYO YUDEN	获取价格	Band Pass Filter
FI212C245034-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s),
FI212C245035-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s),
FI212C245036	TAIYO YUDEN	获取价格	Band Pass Filter,
FI212C245036-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s),
FI212C245041	TAIYO YUDEN	获取价格	Band Pass Filter
FI212C245041-T	TAIYO YUDEN	获取价格	Ferrite Chip, 1 Function(s)

与FI212C245032相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

27
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

19
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

49
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

47

产品中心

服务支持

精选活动

关于我们

帮助中心

FI212C245032

FI212C245032 技术参数

FI212C245032 数据手册

与FI212C245032相关器件

与FI212C245032相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

FI212C245032

FI212C245032 技术参数

FI212C245032 数据手册

与FI212C245032相关器件

与FI212C245032相关文章

您还可以找

您在本页遇到什么问题？