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FHX35LP PDF预览

FHX35LP

更新时间: 2024-01-03 06:18:14
品牌 Logo 应用领域
富士通 - FUJITSU /
页数 文件大小 规格书
4页 158K
描述
RF Small Signal Field-Effect Transistor, 1-Element, KU Band, Silicon, N-Channel, High Electron Mobility FET, HERMETIC SEALED, METAL CERAMIC PACKAGE-4

FHX35LP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Contact Manufacturer零件包装代码:DIE
包装说明:UNCASED CHIP, R-XUUC-NReach Compliance Code:unknown
风险等级:5.28其他特性:LOW NOISE, HIGH RELIABILITY
配置:SINGLE最小漏源击穿电压:4 V
FET 技术:HIGH ELECTRON MOBILITY最高频带:KU BAND
JESD-30 代码:R-XUUC-N元件数量:1
工作模式:DEPLETION MODE封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最小功率增益 (Gp):8.5 dB认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

FHX35LP 数据手册

 浏览型号FHX35LP的Datasheet PDF文件第2页浏览型号FHX35LP的Datasheet PDF文件第3页浏览型号FHX35LP的Datasheet PDF文件第4页 
FHX35X/002  
FHX35LG/002  
Low Noise HEMT  
DESCRIPTION  
The FHX35X/002 Chip and FHX35LG/002 packaged devices are HEMT  
(High Electron Mobility Transistor) ones suitable for use as the front end  
of an optical receiver in high speed lightwave communication systems.  
This HEMT combines high transconductance, low gate capacitance and  
low leakage current; all important factors in achieving low noise  
preamplification. Fujitsu’s stringent Quality Assurance criteria and  
detailed Test Procedures assure Highest Reliabiltity Performance.  
FEATURES  
• High Transconductance  
• Low Leakage Current  
• Low Gate Capacitance  
• Gold Bonding System  
• Proven Reliability  
LG PACKAGE  
ABSOLUTE MAXIMUM RATINGS (Ambient Temperature T =25°C)  
a
Item  
Symbol  
Conditions  
Ratings  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Total Power Dissipation  
Storage Temperature  
Channel Temperature  
Thermal Resistance  
6
-5  
V
V
DS  
V
GS  
mW  
P
290  
T
T
-65 to 175  
+175  
150  
°C  
°C  
stg  
T
ch  
°C/W  
R
Channel to Case  
th  
ELECTRICAL CHARACTERISTICS (Ambient Temperature T =25°C)  
a
Limits  
Min.  
Item  
Drain Current  
Symbol  
Conditions  
Unit  
Min.  
Max.  
I
15  
40  
85  
mA  
mS  
V
V
=2V, V =0V  
DSS  
DS  
GS  
Transconductance  
g
m
V
=2V, I =10mA  
DS DS  
45  
-0.2  
-
60  
-1.0  
10  
-
V
=2V, I =1mA  
Pinch-off Voltage  
V
-2.0  
20  
DS  
DS  
p
I
V
=-2V  
GS  
Gate-Source Leakage Current  
nA  
GSO  
FHX35X/002  
-
-
0.27  
0.47  
-
-
V
=3V  
DS  
Gate-Source Capacitance  
Gate-Drain Capacitance  
C
pF  
pF  
GS  
GD  
I
=10mA  
DS  
FHX35LG/002  
C
V
=3V, I =10mA  
DS  
-
0.035  
-
DS  
Edition 1.1  
May 1998  
1

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