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FGH4L75T65MQDC50 PDF预览

FGH4L75T65MQDC50

更新时间: 2024-10-02 11:11:35
品牌 Logo 应用领域
安森美 - ONSEMI 双极性晶体管
页数 文件大小 规格书
9页 310K
描述
650V Field stop 4th generation mid speed IGBT with co-pack SiC diode 

FGH4L75T65MQDC50 数据手册

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DATA SHEET  
www.onsemi.com  
IGBT - Power, Co-PAK  
N-Channel, Field Stop IV, MQ  
(Medium Speed), TO247-4L  
650 V, 1.45 V, 75 A  
BV  
V
I
C
CES  
CE(sat)  
650 V  
1.45 V  
75 A  
PIN CONNECTIONS  
C
FGH4L75T65MQDC50  
E1: Kelvin Emitter  
E2: Power Emitter  
Using the novel field stop 4th generation IGBT technology and  
generation 1.5 SiC Schottky Diode technology in TO247 4lead  
package, FGH4L75T65MQDC50 offers the optimum performance  
with both low conduction and switching losses for highefficiency  
operations in various applications, especially totem pole bridgeless  
PFC and Inverter.  
G
E1  
E2  
Features  
Positive Temperature Coefficient for Easy Parallel Operation  
High Current Capability  
100% of the Parts are Tested for I (Note 2)  
LM  
Smooth and Optimized Switching  
Low Saturation Voltage: V  
= 1.45 V (Typ.) @ I = 75 A  
C
CE(Sat)  
TO2474LD  
CASE 340CJ  
No Reverse Recovery / No Forward Recovery  
Tight Parameter Distribution  
RoHS Compliant  
MARKING DIAGRAM  
Applications  
Charging Station (EVSE)  
UPS, ESS  
Solar Inverter  
PFC, Converters  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
CollectortoEmitter Voltage  
GatetoEmitter Voltage  
Symbol Value  
Unit  
$Y&Z&3&K  
G75T65  
MQDC50  
V
V
V
650  
20  
CES  
GES  
Transient GatetoEmitter Voltage  
p
30  
(t < 0.5 ms, D < 0.001)  
Collector Current  
I
A
W
A
T
= 25°C (Note 1)  
110  
75  
C
C
T
= 100°C  
= 25°C  
C
Power Dissipation  
P
D
T
385  
192  
300  
300  
60  
C
T
C
= 100°C  
$Y  
= onsemi Logo  
Pulsed Collector Current  
Diode Forward Current  
T
T
= 25°C (Note 2)  
= 25°C (Note 3)  
25°C (Note 1)  
I
LM  
C
&Z  
&3  
&K  
= Assembly Plant Code  
= 3Digit Date Code  
= 2Digit Lot Traceability Code  
I
C
CM  
I
A
T
F
C =  
G75T65MQDC50 = Specific Device Code  
T
100°C  
25°C  
50  
C =  
Pulsed Diode Maximum  
Forward Current  
T
I
200  
A
C =  
FM  
ORDERING INFORMATION  
Operating Junction and Storage Temperature  
Range  
T ,  
STG  
55 to  
°C  
°C  
J
T
+175  
Device  
Package  
Shipping  
Maximum Lead Temperature for Soldering  
Purposes  
T
L
260  
FGH4L75T65MQDC50 TO247 30 Units / Tube  
4LD  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
2. V = 400 V, V = 15 V, I = 300 A, Inductive Load, 100% tested  
CC  
GE  
C
3. Repetitive rating: pulse width limited by max. junction temperature  
© Semiconductor Components Industries, LLC, 2022  
1
Publication Order Number:  
FGH4L75T65MQDC50/D  
October, 2022 Rev. 0  
 

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