FFM101MG THRU FFM107MG
Suface Mount Fast Recovery Rectifier
Forward Current - 1.0Ampere
Reverse Voltage - 50 to 1000 Volts
Package outline
SOD-123FL
Features
Glass passivated device
Ideal for surface mouted applications
Low reverse leakage
Metallurgically bonded construction
High temperature soldering guaranteed:
260 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
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Mechanical data
Case: JEDEC SOD-123FL molded plastic body over passivated chip
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
1.Cathode
2. Anode
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0007 ounce, 0.02 grams
Dimensions in inches and (millimeters)
Maximum Ratings And lEectrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SYMBOLS
FFM102MG
F2
FFM101MG
F1
FFM105MG FFM106MG FFM107MG
FFM103MG FFM104MG
UNITS
F7
F6
F3
F4
F5
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50
35
50
100
70
200
140
200
400
280
400
600
420
600
VOLTS
VOLTS
VOLTS
800
560
800
1000
700
VRRM
VRMS
VDC
Maximum DC blocking voltage
Maximum average forward rectified current
at TA=65 C (NOTE 1)
1000
100
I(AV)
1.0
Amp
Peak forward surge current
IFSM
8.3ms single half sine-wave superimposed on
30
Amps
Volts
rated load (JEDEC Method)
TL=25 C
VF
IR
Maximum instantaneous forward voltage at 1.0A
1.3
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
100
µ
A
TA=125 C
trr
CJ
ns
pF
C
Maximum reverse recovery time (NOTE 2)
Typical junction capacitance (NOTE 3)
500
250
150
15
Operating junction and storage temperature range
TJ,TSTG
-55 to +150
Note:
1.Averaged over any 20ms period.
2.Measured with IF=0.5A, IR=1A, Irr=0.25A.
3.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
REV:1.0
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@ 2018 Copyright By American First Semiconductor