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FF1000R17IE4D_B2 PDF预览

FF1000R17IE4D_B2

更新时间: 2024-11-26 06:59:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管双极性晶体管
页数 文件大小 规格书
9页 1223K
描述
PrimePACK™3 Modul und NTC

FF1000R17IE4D_B2 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:ActiveReach Compliance Code:compliant
风险等级:5.71Is Samacsys:N
峰值回流温度(摄氏度):NOT SPECIFIED端子面层:NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

FF1000R17IE4D_B2 数据手册

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Technische Information / technical information  
IGBT-Module  
IGBT-modules  
FF1000R17IE4D_B2  
PrimePACK™3 Modul und NTC  
PrimePACK™3 module and NTC  
Vorläufige Daten / preliminary data  
V†Š» = 1700V  
I† ÒÓÑ = 1000A / I†ç¢ = 2000A  
Typische Anwendungen  
Typical Applications  
3-Level-Applications  
Auxiliary Inverters  
High Power Converters  
Motor Drives  
3-Level-Applikationen  
Hilfsumrichter  
••  
••  
••  
••  
••  
••  
Hochleistungsumrichter  
Motorantriebe  
Traktionsumrichter  
Windgeneratoren  
Traction Drives  
Wind Turbines  
Elektrische Eigenschaften  
Electrical Features  
Erweiterte Sperrschichttemperatur TÝÎ ÓÔ  
Große DC-Festigkeit  
Extended Operation Temperature TÝÎ ÓÔ  
High DC Stability  
••  
••  
••  
••  
••  
••  
••  
Hohe Stromdichte  
High Current Density  
Niedrige Schaltverluste  
TÝÎ ÓÔ = 150°C  
Low Switching Losses  
TÝÎ ÓÔ = 150°C  
Verstärkte Diode für Rückspeisebetrieb  
niedriges V†ŠÙÈÚ  
Enlarged Diode for regenerative operation  
Low V†ŠÙÈÚ  
Mechanische Eigenschaften  
Mechanical Features  
Gehäuse mit CTI > 400  
Package with CTI > 400  
••  
••  
••  
••  
••  
Große Luft- und Kriechstrecken  
Hohe Last- und thermische Wechselfestigkeit  
Hohe Leistungsdichte  
High Creepage and Clearance Distances  
High Power and Thermal Cycling Capability  
High Power Density  
Kupferbodenplatte  
Copper Base Plate  
Module Label Code  
Barcode Code 128  
Content of the Code  
Digit  
Module Serial Number  
1 - 5  
Module Material Number  
Production Order Number  
Datecode (Production Year)  
Datecode (Production Week)  
6 - 11  
12 - 19  
20 - 21  
22 - 23  
DMX - Code  
prepared by: RH  
approved by: MS  
date of publication: 2009-08-28  
revision: 2.0  
material no: 33333  
1

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