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FDZ4672

更新时间: 2024-11-25 19:56:03
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲晶体管
页数 文件大小 规格书
6页 315K
描述
Power Field-Effect Transistor, 19A I(D), 30V, 0.004ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, 3.50 X 4 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, ULTRA THIN, FLFBGA-30

FDZ4672 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:3.50 X 4 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, ULTRA THIN, FLFBGA-30
针数:30Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.84
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):19 A最大漏极电流 (ID):19 A
最大漏源导通电阻:0.004 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBGA-B30元件数量:1
端子数量:30工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2.35 W最大脉冲漏极电流 (IDM):83 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDZ4672 数据手册

 浏览型号FDZ4672的Datasheet PDF文件第2页浏览型号FDZ4672的Datasheet PDF文件第3页浏览型号FDZ4672的Datasheet PDF文件第4页浏览型号FDZ4672的Datasheet PDF文件第5页浏览型号FDZ4672的Datasheet PDF文件第6页 
March 2008  
FDZ4672  
tm  
N-Channel PowerTrench® MOSFET BGA  
30V, 19A, 4.0mΩ  
Features  
General Description  
„ Max rDS(on) = 4.0mat VGS = 10V, ID = 19A  
„ Max rDS(on) = 7.0mat VGS = 4.5V, ID = 14A  
This part is optimized for very high density and high current  
synchronous buck converters using Fairchild's proprietary  
PowerTrench® process.This part has been tailored for the high  
side application, optimized both for low rDS(on), Qg and package  
parasitics; essential for high efficiency and fast switching. The  
part is offered in a standard format 3.5x4 footprint to offer both  
high side and low side in the same footprint. Partner low side  
FDZ4670 or FDZ4670S (SyncFET TM version).  
„ Ultra-thin package: less than 0.85mm height when mounted to  
PCB  
„ Outstanding thermal transfer characteristics  
„ Ultra-low gate charge x rDS(on) product  
„ RoHS Compliant  
Applications  
„ High Current POL  
„ DC-DC in server  
„ Networking  
„ High current microprocessor  
Gate / Index Slot  
D
G
Bottom  
S
FLFBGA 3.5X4.0  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
±20  
V
V
Drain Current  
-Continuous  
-Pulsed  
TA =25°C  
(Nota 1a)  
19  
ID  
A
83  
Power Dissipation  
Power Dissipation  
TA = 25°C  
TA = 25°C  
(Note 1a)  
(Note 1b)  
2.35  
PD  
W
1.2  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction to Case  
0.85  
52  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
(Note 1b)  
°C/W  
104  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13’’  
Tape Width  
12mm  
Quantity  
4672  
FDZ4672  
FLFBGA 3.5X4.0  
3000 units  
©2008 Fairchild Semiconductor Corporation  
FDZ4672 Rev.B  
1
www.fairchildsemi.com  

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